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Full PDF Text Transcription for MMSZ5248B (Reference)
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MMSZ5248B. For precise diagrams, and layout, please refer to the original PDF.
Surface Mount Zener Diode Features: • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited For Automated Assembly Proces...
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Purpose, Medium Current • Ideally Suited For Automated Assembly Processes Applications: • Zener diode • Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage Power dissipation @ IF=10mA VF PD 0.9 500 Thermal resistance, junction to ambient air RθjA 350 Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms.
MMSZ5248B Datasheet
