Datasheet4U Logo Datasheet4U.com

UPD16877 - MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT

General Description

The µPD16877 is monolithic quad H-bridge driver LSI which uses power MOSFETs in the output stages.

By using the MOS process, this driver IC has substantially improved saturation voltage and power consumption as compared with conventional driver circuits using bipolar transistors.

Key Features

  • Four H bridge circuits employing power MOSFETs Low current consumption by eliminating charge pump VM pin current when power-OFF: 10 µA MAX. VDD pin current: 10 µA MAX. Input logic frequency: 100 kHz 3-V power supply Minimum operating supply voltage: 2.5 V Low voltage malfunction prevention circuit 24-pin plastic TSSOP (5.72 mm (225)).

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
UPD16876 Single Pch High-Side Switch for USB NEC Electronics
UPD168104 6-CHANNEL OPERATIONAL AMPLIFIER Renesas
uPD168110 MICROSTEP DRIVER Renesas
uPD16818 MONOLITHIC DUAL H-BRIDGE DRIVER Renesas
uPD16836 THREE-PHASE SPINDLE MOTOR DRIVER Renesas

Other Datasheets by NEC (now Renesas Electronics)

Part Number Description
UPD16873 MONOLITHIC 3-ASPECT SPINDLE MOTOR DRIVER
UPD16873A MONOLITHIC 3-ASPECT SPINDLE MOTOR DRIVER
UPD16873B MONOLITHIC 3-ASPECT SPINDLE MOTOR DRIVER
UPD16873C MONOLITHIC 3-ASPECT SPINDLE MOTOR DRIVER
UPD16879 MONOLITHIC QUAD H BRIDGE DRIVER CIRCUIT

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
DATA SHEET MOS INTEGRATED CIRCUIT µPD16877 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTION The µPD16877 is monolithic quad H-bridge driver LSI which uses power MOSFETs in the output stages. By using the MOS process, this driver IC has substantially improved saturation voltage and power consumption as compared with conventional driver circuits using bipolar transistors. By eliminating the charge pump circuit, the current during power-OFF is drastically decreased. In addition, a low-voltage malfunction prevention circuit is also provided that prevents the IC from malfunctioning when the supply voltage drops. As the package, a 24-pin plastic TSSOP is adopted to enable the creation of compact, slim application sets.