* DOUBLE LAYER CONSTRUCTION
* POWER BACK-UP FOR CMOS RAM (UP TO 50μA DISCHARGE CURRENT)
* TAPE AND BOX PACKAGING
* SUITABLE FOR FLOW SOLDERING
* LEAD-.

NEXM104Z5.5V10.5X6.5TBF

NEXM103Z5.5V10.5X5TBF

NEXM223Z5.5V10.5X5TBF

NEXM224Z3.5V10.5X6.5TBF

NEXM224Z5.5V10.5X6.5TBF

NEXM473Z3.5V10.5X5TBF

NEXM473Z5.5V10.5X5TBF

NEXM473Z6.5V10.5X6.5TBF

NEX10000UB

NEX10001UB

NEX80601DA

NEX80602DA

NEX80605DA

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