* Pb-free Reflow Soldering Application
* ESD Withstand Voltage (HBM) Class 3B
* RoHS Compliant
* IATF 16.

Package Materials Ceramics Phosphor sheet Materials Phosphor Ceramics Encapsulating Resin Materials Silicone Resin Electrodes Materials Die Heat Sink Materials Weight Au-plated Au-plated 0.0064g(TYP) * 。 Dimensions do not include .

NCSW119BT-V1

NCSW170BT

NCSW170DT-PCB

NCSW170GT

NCSW170GT-SA

NCSW170GT-SB

NCSW219BT-V1

NCSWE17AT

NCSWE17AT-V1

NCS1002

NCS1002A

NCS12802

NCS12D1205C