Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Au-plated Copper Alloy 0.0052g(TYP) * 。 Dimensions do not include mold flash or metal burr. .

NESA064T

NES120

NES1821B-30

NES1823P-100

NES1823P-140

NES1823P-30

NES1823P-45

NES1823P-50

NES240-24

NES240-28

NES240-48

NES2427P-45

NES2427P-60