Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Ag-plated Copper Alloy 0.018g(TYP) * 。 Dimensions do not include mold flash. * a>b、a。 The si.

NF2W757GRT-V1

NF2W757GRT-V1U4

NF2W757GRT-V4H6

NF2W757GT-F1

NF2W757GT-MT

NF2W757DRT-V1M2

NF2W757DRT-V1M3

NF2W757HT-F1

NF2W385ART

NF2W385ART-V3

NF2W557BRT

NF2W585ART

NF2W585ART-P8