NSSG100BT
Description
セラミックス Ceramics
シリコーン樹脂 Silicone Resin
金メッキ Au-plated
0.019g(TYP)
SOLDERING
NICHIA STS-DA1-1939 <Cat.No.110930>
- Remended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat 180 to 200°C
60sec Max Above 220°C
260°C Max 10sec Max
- Remended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
- Remended Soldering Pad Pattern
(単位 Unit: mm)
- This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
- Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
- Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
- Nitrogen reflow soldering is remended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere.
- Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can...
