NSP1832 die equivalent, mems differential pressure sensor die.
* Corrosion-resistant Pt metal bond pad structure
* Enhanced reliability with the double bond pad design
* IATF16949 certificated manufactured platform
*.
such as DPF, GPF, EVAP etc. especially.
The wafer manufactured platform of NSP1832 series MEMS differential pressure sen.
Negative Supply Voltage Negative Supply Voltage Negative Sensor Output Negative Sensor Output Positive Supply Voltage Positive Supply Voltage Substrate Supply Voltage Substrate Supply Voltage Positive Sensor Output Positive Sensor Output
1. All dime.
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