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NTE424 Datasheet Non-Silicone Heat Sink Compound

Manufacturer: NTE Electronics (defunct)

Datasheet Details

Part number NTE424
Manufacturer NTE Electronics (defunct)
File Size 154.20 KB
Description Non-Silicone Heat Sink Compound
Download NTE424 Download (PDF)

General Description

: NTE424 heat sink compound is a grease−like, non−silicone, non−migrating material heavily impregnated with heat−conductive metal oxides.

This formulation provides high thermal conductivity, low bleed and high temperature stability.

NTE424 has been engineered to solve the problems of contamination and migration associated with silicone−based products.

Overview

NTE424 Non−Silicone Thermal Compound 1 oz.

Plunger Tube.

Key Features

  • D Non.
  • Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C.
  • In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL.
  • C.
  • 47113 & MIS.
  • 19846 Specifications D Will Not harden, Dry.
  • Out or Melt D Will Not Contaminate Solder bath or Other Devices D Non.
  • Toxic D Reworkable/Easy to Remove D Easy to Dispense Typical Properties: Viscosity.