Description
NTE424 heat sink compound is a grease
like, non
silicone, non
migrating material heavily impregnated with heat
conductive metal oxides.
based products.
based thermal grease use to insure quick, efficient heat transfer and dissi
Features
- D Non.
- Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C.
- In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL.
- C.
- 47113 & MIS.
- 19846 Specifications D Will Not harden, Dry.
- Out or Melt D Will Not Contaminate Solder bath or Other Devices D Non.
- Toxic D Reworkable/Easy to Remove D Easy to Dispense Typical Properties: Viscosity.
NTE424_NTEElectronics.pdf
