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NXP Semiconductors Electronic Components Datasheet

74AHC04 Datasheet

Hex inverter

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INTEGRATED CIRCUITS
DATA SHEET
74AHC04; 74AHCT04
Hex inverter
Product specification
Supersedes data of 1999 Feb 25
File under Integrated Circuits, IC06
1999 Sep 27


NXP Semiconductors Electronic Components Datasheet

74AHC04 Datasheet

Hex inverter

No Preview Available !

Philips Semiconductors
Hex inverter
Product specification
74AHC04; 74AHCT04
FEATURES
ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
Balanced propagation delays
Inputs accepts voltages higher than
VCC
For AHC only:
operates with CMOS input levels
For AHCT only:
operates with TTL input levels
Specified from
40 to +85 and +125 °C.
DESCRIPTION
The 74AHC/AHCT04 are high-speed
Si-gate CMOS devices and are pin
compatible with low power Schottky
TTL (LSTTL). They are specified in
compliance with JEDEC standard
No. 7A.
The 74AHC/AHCT04 provide six
inverting buffers.
FUNCTION TABLE
See note 1.
INPUT nA
L
H
OUTPUT nY
H
L
Note
1. H = HIGH voltage level;
L = LOW voltage level.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf 3.0 ns.
SYMBOL PARAMETER
CONDITIONS
tPHL/tPLH
CI
CPD
propagation
delay nA to nY
input
capacitance
CL = 15 pF;
VCC = 5 V
VI = VCC or GND
power dissipation CL = 50 pF;
capacitance
f = 1 MHz;
notes 1 and 2
TYPICAL
UNIT
AHC AHCT
3.0 3.0 ns
4.0 4.0 pF
13.5 13.9 pF
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
(CL × VCC2 × fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI = GND to VCC.
PINNING
PIN
1, 3, 5, 9, 11 and 13
2, 4, 6, 8, 10 and 12
7
14
SYMBOL
1A to 6A
1Y to 6Y
GND
VCC
DESCRIPTION
data inputs
data outputs
ground (0 V)
DC supply voltage
1999 Sep 27
2


Part Number 74AHC04
Description Hex inverter
Maker NXP
Total Page 16 Pages
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