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74HCU04D-Q100 Datasheet

Hex unbuffered inverter

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74HCU04-Q100
Hex unbuffered inverter
Rev. 2 — 22 October 2015
Product data sheet
1. General description
The 74HCU04-Q100 is a hex unbuffered inverter. Inputs include clamp diodes that enable
the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Complies with JEDEC standard JESD7A
Balanced propagation delays
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
Multiple package options
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature
range
Name
Description
74HCU04D-Q100 40 C to +125 C SO14
plastic small outline package; 14 leads; body width
3.9 mm
74HCU04PW-Q100 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
74HCU04BQ-Q100 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
Version
SOT108-1
SOT402-1
SOT762-1


NXP Semiconductors Electronic Components Datasheet

74HCU04D-Q100 Datasheet

Hex unbuffered inverter

No Preview Available !

NXP Semiconductors
4. Functional diagram
74HCU04-Q100
Hex unbuffered inverter
1 1A
3 2A
5 3A
9 4A
11 5A
13 6A
1Y 2
2Y 4
3Y 6
4Y 8
5Y 10
6Y 12
mna342
Fig 1. Logic symbol
1
12
1
34
1
56
1
98
1
11 10
1
13 12
mna343
Fig 2. IEC logic symbol
5. Pinning information
AY
mna045
Fig 3. Logic diagram (one
inverter)
+&84
$ 
< 
$ 
< 
$ 
< 
*1' 
 9&&
 $
 <
 $
 <
 $
 <
DDD
Fig 4. Pin configuration SO14 and TSSOP14
+&84
WHUPLQDO
LQGH[DUHD
< 
$ 
< 
$ 
< 
9&& 
 $
 <
 $
 <
 $
DDD
7UDQVSDUHQWWRSYLHZ
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to VCC.
Fig 5. Pin configuration DHVQFN14
74HCU04_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 22 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 16


Part Number 74HCU04D-Q100
Description Hex unbuffered inverter
Maker NXP
Total Page 16 Pages
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