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BYG26 Datasheet - NXP

SMA ultra fast soft-recovery controlled avalanche rectifiers

BYG26 Features

* Glass passivated

* High maximum operating temperature

* Ideal for surface mount automotive applications

* Low leakage current

* Excellent stability

* Guaranteed avalanche energy absorption capability

* UL 94V-O classified plastic package

BYG26 General Description

DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. cathode band k a Side view MSA474 Fig.1 Simplified outline (DO-214AC) and symbol. LIMITING VALUES I.

BYG26 Datasheet (60.31 KB)

Preview of BYG26 PDF

Datasheet Details

Part number:

BYG26

Manufacturer:

NXP ↗

File Size:

60.31 KB

Description:

Sma ultra fast soft-recovery controlled avalanche rectifiers.
DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D168 BYG26 series SMA ultra fast soft-recovery controlled avalanche rectifiers Product specifica.

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BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers NXP

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