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NXP Semiconductors Electronic Components Datasheet

K12P48M50SF4 Datasheet

MCU

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Freescale Semiconductor
Data Sheet: Technical Data
K12 Sub-Family
Supports the following:
MK12DX128VLF5, MK12DX256VLF5
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 50 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 256 KB program flash for devices with
FlexNVM.
– 64 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 64 KB RAM
– Serial programming interface (EzPort)
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Document Number: K12P48M50SF4
Rev. 4, 08/2013
K12P48M50SF4
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
Human-machine interface
– General-purpose input/output
Analog modules
– 16-bit SAR ADC
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel general purpose timers, one with
quadrature decoder functionality
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB Device Charger detect
– SPI module
– I2C module
– Four UART modules
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.


NXP Semiconductors Electronic Components Datasheet

K12P48M50SF4 Datasheet

MCU

No Preview Available !

Table of Contents
1 Ordering parts...........................................................................3
5.3.2 General switching specifications...........................20
1.1 Determining valid orderable parts......................................3
5.4 Thermal specifications.......................................................20
2 Part identification......................................................................3
5.4.1 Thermal operating requirements...........................21
2.1 Description.........................................................................3
5.4.2 Thermal attributes.................................................21
2.2 Format...............................................................................3
6 Peripheral operating requirements and behaviors....................22
2.3 Fields.................................................................................3
6.1 Core modules....................................................................22
2.4 Example............................................................................4
6.1.1 JTAG electricals....................................................22
2.5 Small package marking.....................................................4
6.2 System modules................................................................25
3 Terminology and guidelines......................................................5
6.3 Clock modules...................................................................25
3.1 Definition: Operating requirement......................................5
6.3.1 MCG specifications...............................................25
3.2 Definition: Operating behavior...........................................5
6.3.2 Oscillator electrical specifications.........................27
3.3 Definition: Attribute............................................................6
6.3.3 32 kHz oscillator electrical characteristics.............29
3.4 Definition: Rating...............................................................6
6.4 Memories and memory interfaces.....................................30
3.5 Result of exceeding a rating..............................................7
6.4.1 Flash electrical specifications................................30
3.6 Relationship between ratings and operating
6.4.2 EzPort switching specifications.............................33
requirements......................................................................7
6.5 Security and integrity modules..........................................34
3.7 Guidelines for ratings and operating requirements............8
6.6 Analog...............................................................................34
3.8 Definition: Typical value.....................................................8
6.6.1 ADC electrical specifications.................................34
3.9 Typical value conditions....................................................9
6.6.2 CMP and 6-bit DAC electrical specifications.........38
4 Ratings......................................................................................9
6.6.3 Voltage reference electrical specifications............41
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................42
4.2 Moisture handling ratings..................................................10
6.8 Communication interfaces.................................................42
4.3 ESD handling ratings.........................................................10
6.8.1 DSPI switching specifications (limited voltage
4.4 Voltage and current operating ratings...............................10
range)....................................................................42
5 General.....................................................................................10
6.8.2 DSPI switching specifications (full voltage range).44
5.1 AC electrical characteristics..............................................11
6.8.3 I2C switching specifications..................................46
5.2 Nonswitching electrical specifications...............................11
6.8.4 UART switching specifications..............................46
5.2.1 Voltage and current operating requirements.........11
6.8.5 Normal Run, Wait and Stop mode performance
5.2.2 LVD and POR operating requirements.................12
over the full operating voltage range.....................46
5.2.3 Voltage and current operating behaviors..............13
6.8.6 VLPR, VLPW, and VLPS mode performance
5.2.4 Power mode transition operating behaviors..........13
over the full operating voltage range.....................48
5.2.5 Power consumption operating behaviors..............14
7 Dimensions...............................................................................50
5.2.6 EMC radiated emissions operating behaviors.......18
7.1 Obtaining package dimensions.........................................50
5.2.7 Designing with radiated emissions in mind...........19
8 Pinout........................................................................................50
5.2.8 Capacitance attributes..........................................19
8.1 K12 Signal Multiplexing and Pin Assignments..................50
5.3 Switching specifications.....................................................19
8.2 K12 Pinouts.......................................................................53
5.3.1 Device clock specifications...................................19
9 Revision History........................................................................54
K12 Sub-Family Data Sheet, Rev. 4, 08/2013.
2
Freescale Semiconductor, Inc.


Part Number K12P48M50SF4
Description MCU
Maker NXP
Total Page 3 Pages
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