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NXP Semiconductors Electronic Components Datasheet

K20P81M100SF2V2 Datasheet

Microcontroller

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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K20P81M100SF2V2
Rev. 3, 6/2013
K20 Sub-Family
Supports the following:
MK20DX256VLK10, MK20DN512VLK10
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
K20P81M100SF2V2
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– 12-bit DAC
– Two transimpedance amplifiers
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Two Controller Area Network (CAN) modules
– Two SPI modules
– Two I2C modules
– Four UART modules
– Secure Digital host controller (SDHC)
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.


NXP Semiconductors Electronic Components Datasheet

K20P81M100SF2V2 Datasheet

Microcontroller

No Preview Available !

Table of Contents
1 Ordering parts...........................................................................4
6 Peripheral operating requirements and behaviors....................23
1.1 Determining valid orderable parts......................................4
6.1 Core modules....................................................................23
2 Part identification......................................................................4
6.1.1 Debug trace timing specifications.......................23
2.1 Description.........................................................................4
6.1.2 JTAG electricals..................................................24
2.2 Format...............................................................................4
6.2 System modules................................................................27
2.3 Fields.................................................................................4
6.3 Clock modules...................................................................27
2.4 Example............................................................................5
6.3.1 MCG specifications.............................................27
3 Terminology and guidelines......................................................5
6.3.2 Oscillator electrical specifications.......................29
3.1 Definition: Operating requirement......................................5
6.3.3 32 kHz oscillator electrical characteristics..........32
3.2 Definition: Operating behavior...........................................6
6.4 Memories and memory interfaces.....................................32
3.3 Definition: Attribute............................................................6
6.4.1 Flash electrical specifications.............................32
3.4 Definition: Rating...............................................................7
6.4.2 EzPort switching specifications...........................34
3.5 Result of exceeding a rating..............................................7
6.4.3 Flexbus switching specifications.........................35
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................38
requirements......................................................................7
6.6 Analog...............................................................................38
3.7 Guidelines for ratings and operating requirements............8
6.6.1 ADC electrical specifications..............................38
3.8 Definition: Typical value.....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications......46
3.9 Typical value conditions....................................................9
6.6.3 12-bit DAC electrical characteristics...................49
4 Ratings......................................................................................10
6.6.4 Voltage reference electrical specifications..........52
4.1 Thermal handling ratings...................................................10
6.7 Timers................................................................................53
4.2 Moisture handling ratings..................................................10
6.8 Communication interfaces.................................................53
4.3 ESD handling ratings.........................................................10
6.8.1 USB electrical specifications...............................53
4.4 Voltage and current operating ratings...............................10
6.8.2 USB DCD electrical specifications......................54
5 General.....................................................................................11
6.8.3 USB VREG electrical specifications...................54
5.1 AC electrical characteristics..............................................11
6.8.4 CAN switching specifications..............................55
5.2 Nonswitching electrical specifications...............................11
6.8.5 DSPI switching specifications (limited voltage
5.2.1 Voltage and current operating requirements......12
range).................................................................55
5.2.2 LVD and POR operating requirements...............13
6.8.6 DSPI switching specifications (full voltage
5.2.3 Voltage and current operating behaviors............13
range).................................................................56
5.2.4 Power mode transition operating behaviors.......15
6.8.7 Inter-Integrated Circuit Interface (I2C) timing..... 58
5.2.5 Power consumption operating behaviors............16
6.8.8 UART switching specifications............................59
5.2.6 EMC radiated emissions operating behaviors....19
6.8.9 SDHC specifications...........................................59
5.2.7 Designing with radiated emissions in mind.........20
6.8.10 I2S/SAI switching specifications.........................60
5.2.8 Capacitance attributes........................................20
6.9 Human-machine interfaces (HMI)......................................67
5.3 Switching specifications.....................................................20
6.9.1 TSI electrical specifications................................67
5.3.1 Device clock specifications.................................20
7 Dimensions...............................................................................68
5.3.2 General switching specifications.........................21
7.1 Obtaining package dimensions.........................................68
5.4 Thermal specifications.......................................................22
8 Pinout........................................................................................68
5.4.1 Thermal operating requirements.........................22
8.1 K20 signal multiplexing and pin assignments....................68
5.4.2 Thermal attributes...............................................22
8.2 K20 pinouts.......................................................................72
K20 Sub-Family Data Sheet, Rev. 3, 6/2013.
2
Freescale Semiconductor, Inc.


Part Number K20P81M100SF2V2
Description Microcontroller
Maker NXP
Total Page 3 Pages
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