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NXP Semiconductors Electronic Components Datasheet

MC13226V Datasheet

Compliant PiP

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Freescale Semiconductor
Technical Data
Document Number: MC1322x
Rev. 1.3 10/2010
MC1322x
MC1322x
Advanced ZigBee- Compliant
Platform-in-Package (PiP) for the
2.4 GHz IEEE® 802.15.4
Standard
1 Introduction
The MC1322x family is Freescale’s third-generation
ZigBee platform which incorporates a complete, low
power, 2.4 GHz radio frequency transceiver, 32-bit
ARM7 core based MCU, hardware acceleration for both
the IEEE 802.15.4 MAC and AES security, and a full set
of MCU peripherals into a 99-pin LGA
Platform-in-Package (PiP).
The MC1322x solution can be used for wireless
applications ranging from simple proprietary
point-to-point connectivity to complete ZigBee mesh
networking. The MC1322x is designed to provide a
highly integrated, total solution, with premier processing
capabilities and very low power consumption.
Package Information
Case 1901-01
99-Pin [9.5X9.5X1.2mm]
Ordering Information
Device
Device Marking
MC13224V1
MC13224VR21
MC13224V
MC13224V
MC13226V1
MC13226VR21
MC13226V
MC13226V
1 See Table 1 for more details.
Package
LGA
LGA
LGA
LGA
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 High Density, Low Component Count, Integrated
IEEE 802.15.4 Solution
10
4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 MCU Peripherals . . . . . . . . . . . . . . . . . . . . . . 19
6 Pin Assignments and Connections . . . . . . 28
7 System Electrical Specification . . . . . . . . . 36
8 Developer Environment . . . . . . . . . . . . . . . . 48
9 Mechanical Diagrams
(Case 1901-01, non-JEDEC)
51
The MC1322x MCU resources offer superior processing
power for ZigBee applications. A full 32-bit
ARM7TDMI-S core operates up to 26 MHz. A 128
Kbyte FLASH memory is mirrored into a 96 Kbyte
RAM for upper stack and applications software. In
addition, an 80 Kbyte ROM is available for boot
software, standardized IEEE 802.15.4 MAC and
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.


NXP Semiconductors Electronic Components Datasheet

MC13226V Datasheet

Compliant PiP

No Preview Available !

communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for
transceiver packet data complement the processor core.
The RF radio interface provides for low cost and the high density as shown in Figure 1. An onboard balun
along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA
provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides
-96 dBm sensitivity. In addition, separate complementary PA outputs allow use of an external PA and/or
an external LNA for extended range applications. The device also has onboard bypass capacitors and
crystal load capacitors for the smallest footprint in the industry. All components are integrated into the
package except the crystal and antenna.
BALUN
RF
TX/RX
SWITCH
PA
LNA
ANALOG
TRANSMITTER
ANALOG
RECEIVER
Figure 1. MC1322x RF Radio Interface
In addition to the best-in-class MCU performance and power, the MC1322x also provides best-in-class
power savings. Typical transmit current is 29 mA and typical receive current is 22 mA with the CPU at 2
MHz operation and even lower with the bus stealing enabled. Onboard power supply regulation is
provided for source voltages from 2.0 Vdc to 3.6 Vdc. Numerous low current modes are available to
maximize battery life including sleep or restricted performance operation.
Applications include, but are not limited to, the following:
• Residential and commercial automation
— Lighting control
— Security
— Access control
— Heating, ventilation, air-conditioning (HVAC)
— Automated meter reading (AMR)
• Industrial Control
MC1322x Technical Data, Rev. 1.3
2
Freescale Semiconductor


Part Number MC13226V
Description Compliant PiP
Maker NXP
Total Page 3 Pages
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