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MC13226V Datasheet Compliant PiP

Manufacturer: NXP Semiconductors

Download the MC13226V datasheet PDF. This datasheet also includes the MC13224V variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (MC13224V-NXP.pdf) that lists specifications for multiple related part numbers.

Overview

Freescale Semiconductor Technical Data Document Number: MC1322x Rev.

1.3 10/2010 MC1322x MC1322x Advanced ZigBee™- Compliant Platform-in-Package (PiP) for the 2.4 GHz IEEE® 802.15.4 Standard 1 Introduction The MC1322x family is Freescale’s third-generation ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP).

The MC1322x solution can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking.

Key Features

  • . . . . 4 3 High Density, Low Component Count, Integrated IEEE 802.15.4 Solution 10 4 Memory.
  • . . . . 18 5 MCU Peripherals.
  • . . 19 6 Pin Assignments and Connections.
  • . 28 7 System Electrical Specification.
  • . . . . 36 8 Developer Environment.
  • . 48 9 Mechanical Diagrams (Case 1901-01, non-JEDEC) 51 The MC1322x MCU resource.

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