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MC13226V - Compliant PiP

This page provides the datasheet information for the MC13226V, a member of the MC13224V Compliant PiP family.

Datasheet Summary

Features

  • . . . . 4 3 High Density, Low Component Count, Integrated IEEE 802.15.4 Solution 10 4 Memory.
  • . . . . 18 5 MCU Peripherals.
  • . . 19 6 Pin Assignments and Connections.
  • . 28 7 System Electrical Specification.
  • . . . . 36 8 Developer Environment.
  • . 48 9 Mechanical Diagrams (Case 1901-01, non-JEDEC) 51 The MC1322x MCU resource.

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Datasheet preview – MC13226V

Datasheet Details

Part number MC13226V
Manufacturer NXP
File Size 608.24 KB
Description Compliant PiP
Datasheet download datasheet MC13226V Datasheet
Additional preview pages of the MC13226V datasheet.
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Full PDF Text Transcription

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Freescale Semiconductor Technical Data Document Number: MC1322x Rev. 1.3 10/2010 MC1322x MC1322x Advanced ZigBee™- Compliant Platform-in-Package (PiP) for the 2.4 GHz IEEE® 802.15.4 Standard 1 Introduction The MC1322x family is Freescale’s third-generation ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP). The MC1322x solution can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking.
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