Table of Contents
1. Simplified application diagrams ..................................................................................................................................................... 3
2. Orderable part ................................................................................................................................................................................ 7
3. Internal block diagrams .................................................................................................................................................................. 9
4. Pin Connections ........................................................................................................................................................................... 11
4.1. Pinout diagram ....................................................................................................................................................................... 11
5. Electrical characteristics .............................................................................................................................................................. 16
5.1. Maximum ratings .................................................................................................................................................................... 16
5.2. Static electrical characteristics ............................................................................................................................................... 18
5.3. Dynamic electrical characteristics .......................................................................................................................................... 26
5.4. Timing diagrams .................................................................................................................................................................... 29
6. Functional description .................................................................................................................................................................. 32
6.1. Introduction ............................................................................................................................................................................ 32
6.2. Functional pin description ...................................................................................................................................................... 32
7. Functional device operation ......................................................................................................................................................... 36
7.1. Mode and state description .................................................................................................................................................... 36
7.2. LP modes ............................................................................................................................................................................... 37
7.3. State diagram ......................................................................................................................................................................... 39
7.4. Mode change ......................................................................................................................................................................... 40
7.5. Watchdog operation ............................................................................................................................................................... 40
7.6. Functional block operation versus mode ............................................................................................................................... 43
7.7. Illustration of device mode transitions .................................................................................................................................... 44
7.8. Cyclic sense operation during LP modes ............................................................................................................................... 45
7.9. Cyclic INT operation during LP VDD on mode ....................................................................................................................... 47
7.10. Behavior at power up and power down ................................................................................................................................ 48
7.11. Fail-safe operation ............................................................................................................................................................... 51
8. CAN interface .............................................................................................................................................................................. 55
8.1. CAN interface description ...................................................................................................................................................... 55
8.2. CAN bus fault diagnostic ........................................................................................................................................................ 58
9. LIN block ...................................................................................................................................................................................... 62
9.1. LIN interface description ........................................................................................................................................................ 62
9.2. LIN operational modes ........................................................................................................................................................... 63
10. Serial peripheral interface .......................................................................................................................................................... 64
10.1. High level overview .............................................................................................................................................................. 64
10.2. Detail operation .................................................................................................................................................................... 64
10.3. Detail of control bits and register mapping ........................................................................................................................... 68
10.4. Flags and device status ....................................................................................................................................................... 84
11. Typical applications ................................................................................................................................................................... 92
12. Packaging ................................................................................................................................................................................ 100
12.1. SOIC 32 package dimensions ........................................................................................................................................... 100
12.2. SOIC 54 package dimensions ........................................................................................................................................... 103
13. Revision history ....................................................................................................................................................................... 106
33903/4/5
2
NXP Semiconductors
