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NXP Semiconductors Electronic Components Datasheet

MC56F83689 Datasheet

digital signal controller

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NXP Semiconductors
Data Sheet: Technical Data
MC56F836xx
Supports MC56F836xx
Features
• This family of digital signal controllers (DSCs) is
based on the 32-bit 56800EX core. On a single chip,
each device combines the processing power of a DSP
and the functionality of an MCU, with a flexible set of
peripherals to support many target applications:
– Industrial control
– Home appliances
– General-purpose inverters
– Smart sensors, fire and security systems
– Switched-mode power supply and power
management
– Power distribution systems
– Motor control (ACIM, BLDC, PMSM, SR, stepper)
– Uninterruptible power supplies (UPS)
– Solar inverter
– Medical monitoring applications
• DSC based on 32-bit 56800EX core
– Up to 100 MIPS at 100 MHz core frequency
– DSP and MCU functionality in a unified, C-efficient
architecture
• On-chip memory
– Up to 2×128 KB dual partition flash memory with
ECC protection
– Up to 64 KB data/program RAM
– Both on-chip flash memory and RAM can be
mapped into both program and data memory spaces
– 32 KB boot ROM supports boot from SCI, I2C and
CAN
• Analog
– Two high-speed, 8-ch external and 2-ch internal, 12-
bit ADCs with dynamic x1, x2, and x4
programmable amplifier
– Four analog comparators with integrated 8-bit DAC
references
• Two standard FlexPWM modules with up to 2x8 PWM
outputs
Document Number MC56F836XXDS
Rev. 1.6, 09/2019
MC56F836XXDS
• Communication interfaces
– Up to three high-speed queued SCI (QSCI) modules
with LIN slave functionality
– Up to two queued SPI (QSPI) modules
– Two I2C/SMBus ports
– One FlexCAN module, with Flexible Data-rate
(CAN-FD) supported
– One USB2.0 controller with integrated PHY
• Timers
– Two 16-bit quad timer (2 x 4 16-bit timer)
– Two Periodic Interval Timers (PITs)
• Security and integrity
– Cyclic Redundancy Check (CRC) generator
– Windowed Computer operating properly (COP)
watchdog
– External Watchdog Monitor (EWM)
• Clocks
– On-chip relaxation oscillators: 200 kHz, and 48
MHz IRC
– Crystal / resonator oscillator
• System
– Integrated power-on reset (POR) and low-voltage
interrupt (LVI) and brown-out reset module
– Inter-Module Crossbar and Event Generator
– JTAG/enhanced on-chip emulation (EOnCE) for
unobtrusive, real-time debugging
• Operating characteristics
– Single supply: 2.7 V to 3.6 V
– 5 V–tolerant I/O (except for 3.3 V RESETB and
USB_DP/USB_DM pins)
– Operation ambient temperature: V temperature
option: -40°C to 105°C
• 100-pin LQFP, 80-pin LQFP, and 64-pin LQFP
packages
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.


NXP Semiconductors Electronic Components Datasheet

MC56F83689 Datasheet

digital signal controller

No Preview Available !

Table of Contents
1 Overview............................................................................................ 3
5.2 Moisture handling ratings........................................................20
1.1 Product Family........................................................................ 3
5.3 ESD handling ratings.............................................................. 20
1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........4
5.4 Voltage and current operating ratings..................................... 20
1.3 Operation Parameters.............................................................. 4
6 General............................................................................................... 22
1.4 Interrupt Controller................................................................. 5
6.1 General characteristics............................................................ 22
1.5 Peripheral highlights............................................................... 5
6.2 AC electrical characteristics....................................................23
1.6 Block diagrams........................................................................11
6.3 Nonswitching electrical specifications....................................23
2 Ordering parts.....................................................................................13
6.4 Switching specifications..........................................................29
2.1 Determining valid orderable parts...........................................14
6.5 Thermal specifications............................................................ 30
2.2 Part number list....................................................................... 14
7 Peripheral operating requirements and behaviors.............................. 31
3 Part identification............................................................................... 14
7.1 Core modules...........................................................................31
3.1 Description.............................................................................. 14
7.2 System modules.......................................................................33
3.2 Format..................................................................................... 14
7.3 Clock modules.........................................................................33
3.3 Fields....................................................................................... 14
7.4 Memories and memory interfaces........................................... 35
3.4 Example...................................................................................15
7.5 Analog..................................................................................... 37
4 Terminology and guidelines...............................................................15
7.6 PWMs and timers.................................................................... 42
4.1 Definition: Operating requirement.......................................... 15
7.7 Communication interfaces.......................................................42
4.2 Definition: Operating behavior............................................... 16
8 Design Considerations....................................................................... 48
4.3 Definition: Attribute................................................................16
8.1 Thermal design considerations................................................48
4.4 Definition: Rating....................................................................16
8.2 Electrical design considerations.............................................. 50
4.5 Result of exceeding a rating.................................................... 17
8.3 Power-on Reset design considerations....................................51
4.6 Relationship between ratings and operating requirements......17
9 Obtaining package dimensions.......................................................... 52
4.7 Guidelines for ratings and operating requirements................. 18
10 Pinout................................................................................................. 52
4.8 Definition: Typical value........................................................ 18
10.1 Signal Multiplexing and Pin Assignments.............................. 52
4.9 Typical value conditions......................................................... 19
10.2 Pinout diagrams.......................................................................55
5 Ratings................................................................................................19
11 Product documentation.......................................................................58
5.1 Thermal handling ratings........................................................ 19
12 Revision history................................................................................. 59
MC56F836xx, Rev. 1.6, 09/2019
2
NXP Semiconductors


Part Number MC56F83689
Description digital signal controller
Maker NXP
Total Page 3 Pages
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