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NXP Semiconductors Electronic Components Datasheet

MCIMX537CVV8C Datasheet

Applications Processor

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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX53IEC
Rev. 7, 05/2015
MCIMX53xC
i.MX53 Applications
Processors for Industrial
Products
Silicon Version 2.1
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 2
1 Introduction
The i.MX53 processor features ARM Cortex™-A8
core, which operates at clock speeds as high as
800 MHz. It provides DDR2/LVDDR2-800,
LPDDR2-800, or DDR3-800 DRAM memories.
The flexibility of the i.MX53 architecture allows for its
use in a wide variety of applications. As the heart of the
application chipset, the i.MX53 processor provides all
the interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, hard drive, camera sensors,
and dual displays.
Features of the i.MX53 processor include the following:
• Applications processor—The i.MX53xD
processors boost the capabilities of high-tier
portable applications by satisfying the ever
increasing MIPS needs of operating systems and
games. Freescale’s Dynamic Voltage and
Frequency Scaling (DVFS) provides significant
power reduction, allowing the device to run at
lower voltage and frequency with sufficient
MIPS for tasks such as audio decode.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Functional Part Differences and Ordering
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16
4.2. Power Supply Requirements and Restrictions . . . 23
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4. Output Buffer Impedance Characteristics . . . . . . 32
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43
4.7. External Peripheral Interfaces Parameters . . . . . 65
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144
6. Package Information and Contact Assignments . . . . . 145
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
© 2011-2015 Freescale Semiconductor, Inc. All rights reserved.


NXP Semiconductors Electronic Components Datasheet

MCIMX537CVV8C Datasheet

Applications Processor

No Preview Available !

Introduction
• Multilevel memory system—The multilevel memory system of the i.MX53 is based on the L1
instruction and data caches, L2 cache, internal and external memory. The i.MX53 supports many
types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3, NOR
Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND
including eMMC up to rev 4.4.
• Smart speed technology—The i.MX53 device has power management throughout the IC that
enables the rich suite of multimedia features and peripherals to consume minimum power in both
active and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product requiring levels of power far lower than industry expectations.
• Multimedia powerhouse—The multimedia performance of the i.MX53 processor ARM core is
boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision
floating point support) and vector floating point coprocessors. The system is further enhanced by
a multi-standard hardware video codec, autonomous image processing unit (IPU), and a
programmable smart DMA (SDMA) controller.
• Powerful graphics acceleration— The i.MX53 processors provide two independent, integrated
graphics processing units: an OpenGL® ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s,
and 800 Mpix/s z-plane performance) and an OpenVG™ 1.1 2D graphics accelerator
(200 Mpix/s).
• Interface flexibility—The i.MX53 processor supports connection to a variety of interfaces,
including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go
with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed
MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces
(PATA, UART, I2C, and I2S serial audio, among others).
• Advanced security—The i.MX53 processors deliver hardware-enabled security features that
enable secure e-commerce, digital rights management (DRM), information encryption, secure
boot, and secure software downloads. For detailed information about the i.MX53 security features
contact a Freescale representative.
The i.MX53 application processor is a follow-on to the i.MX51, with improved performance, power
efficiency, and multimedia capabilities.
1.1 Functional Part Differences and Ordering Information
shows the functional differences between the different parts in the i.MX53 family.
Table 1 provides ordering information.
Table 1. Ordering Information
Part Number
Mask Set
CPU Frequency
Notes
Package1
MCIMX537CVV8C
3N78C
800 MHz
1 Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3.
19 x 19 mm, 0.8 mm pitch BGA
Case TEPBGA-2
i.MX53 Applications Processors for Industrial Products, Rev. 7
2
Freescale Semiconductor


Part Number MCIMX537CVV8C
Description Applications Processor
Maker NXP
Total Page 3 Pages
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