900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf




NXP Semiconductors Electronic Components Datasheet

MCIMX6QP7CVT8AB Datasheet

Applications Processor

No Preview Available !

NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6DQPIEC
Rev. 3, 11/2018
MCIMX6QPxCxxxxA
MCIMX6QPxCxxxxB
MCIMX6DPxCxxxxA
MCIMX6DPxCxxxxB
i.MX 6DualPlus/6QuadPlus
Applications Processors
Industrial Products
Package Information
FCPBGA Package
21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1
1 Introduction
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 2
The i.MX 6DualPlus/6QuadPlus processors offer the
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7
highest levels of graphics processing performance in the 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
i.MX 6 series family and are ideally suited for graphics
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
intensive applications.
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
The i.MX 6DualPlus/6QuadPlus processors feature
advanced implementation of the quad
Arm® Cortex®-A9 core, which operates at speeds up to
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20
4.2 Power Supplies Requirements and Restrictions . . 33
800 MHz. They include updated versions of the 2D and
3D graphics processors, 1080p video processing, and
4.3 Integrated LDO Voltage Regulator Parameters . . 34
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37
integrated power management. Each processor provides
a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface
and a number of other interfaces for connecting
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53
peripherals, such as WLAN, Bluetooth®, GPS, hard
drive, displays, and camera sensors.
4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64
4.11 General-Purpose Media Interface (GPMI) Timing. 64
4.12 External Peripheral Interface Parameters . . . . . . . 73
The i.MX 6DualPlus/6QuadPlus processors are
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138
specifically useful for applications such as the
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139
following:
6 Package Information and Contact Assignments . . . . . . 141
6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141
• Graphics rendering for Human Machine
6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141
Interfaces (HMI)
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
• Video processing and display
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.


NXP Semiconductors Electronic Components Datasheet

MCIMX6QP7CVT8AB Datasheet

Applications Processor

No Preview Available !

Introduction
The i.MX 6DualPlus/6QuadPlus processors offers numerous advanced features, such as:
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash,
PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND,
including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the device that
enables the rich suite of multimedia features and peripherals to consume minimum power in both
active and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, Neon® MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, 2 autonomous and independent image processing units (IPU), and a
programmable smart DMA (SDMA) controller.
• Powerful graphics acceleration—Each processor provides three independent, integrated graphics
processing units: an OpenGL® ES 3.0 3D graphics accelerator with four shaders (up to 198 MTri/s
and OpenCL support), 2D graphics accelerator, and dedicated OpenVG™ 1.1 accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces
(such as UART, I2C, and I2S serial audio, SATA-II, and PCIe-II).
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad
security reference manual (IMX6DQ6SDLSRM).
• Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
1.1 Ordering Information
Table 1 shows examples of orderable part numbers covered by this data sheet. This table does not include
all possible orderable part numbers. The latest part numbers are available on nxp.com/imx6series. If your
desired part number is not listed in the table, or you have questions about available parts, see
nxp.com/imx6series or contact your NXP representative.
i.MX 6DualPlus/6QuadPlus Applications Processors Industrial Products, Rev. 3, 11/2018
2
NXP Semiconductors


Part Number MCIMX6QP7CVT8AB
Description Applications Processor
Maker NXP
Total Page 3 Pages
PDF Download

MCIMX6QP7CVT8AB Datasheet PDF

View PDF for Mobile






Similar Datasheet

1 MCIMX6QP7CVT8AA Applications Processor
NXP
2 MCIMX6QP7CVT8AB Applications Processor
NXP





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z

Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy