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NXP Semiconductors Electronic Components Datasheet

MCIMX6S6AVM08AB Datasheet

Applications Processor

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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SDLAEC
Rev. 9, 11/2018
MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB
MCIMX6SxAxxxxxC MCIMX6UxAxxxxxC
MCIMX6SxAxxxxxD MCIMX6UxAxxxxxD
i.MX 6Solo/6DualLite
Automotive and
Infotainment
Applications Processors
Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
1 Introduction
1
The i.MX 6Solo/6DualLite automotive and infotainment
processors represent the latest achievement in integrated 2
multimedia-focused products offering high-performance 3
processing with a high degree of functional integration.
These processors are designed considering the needs of
the growing automotive infotainment, telematics, HMI, 4
and display-based cluster markets.
The processors feature advanced implementation of
single/dual Arm® Cortex®-A9 core, which operates at
speeds of up to 1 GHz. They include 2D and 3D graphics
processors, 1080p video processing, and integrated
power management. Each processor provides a 32/64-bit
DDR3/DDR3L/LPDDR2-800 memory interface and a
number of other interfaces for connecting peripherals, 5
such as WLAN, Bluetooth®, GPS, hard drive, displays,
and camera sensors.
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.3 Updated Signal Naming Convention . . . . . . . . . . . .9
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.1 Special Signal Considerations . . . . . . . . . . . . . . . .21
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .23
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .23
4.2 Power Supplies Requirements and Restrictions . .33
4.3 Integrated LDO Voltage Regulator Parameters . . .34
4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . .36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .44
4.8 Output Buffer Impedance Parameters . . . . . . . . . .49
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . .52
4.10 General-Purpose Media Interface (GPMI) Timing .64
4.11 External Peripheral Interface Parameters . . . . . . .72
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .134
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .134
5.2 Boot Device Interface Allocation . . . . . . . . . . . . .135
Package Information and Contact Assignments . . . . . .136
6.1 Updated Signal Naming Convention . . . . . . . . . .136
6.2 21x21 mm Package Information. . . . . . . . . . . . . .137
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products


NXP Semiconductors Electronic Components Datasheet

MCIMX6S6AVM08AB Datasheet

Applications Processor

No Preview Available !

Introduction
The i.MX 6Solo/6DualLite processors are specifically useful for applications such as:
• Automotive navigation and entertainment
• Graphics rendering for Human Machine Interfaces (HMI)
• High-performance speech processing with large databases
• Audio playback
• Video processing and display
The i.MX 6Solo/6DualLite applications processors feature:
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash,
PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND,
including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the IC that enables
the rich suite of multimedia features and peripherals to consume minimum power in both active
and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, an image processing unit (IPU), a programmable smart DMA (SDMA)
controller, and an asynchronous sample rate converter.
• Powerful graphics acceleration—Each processor provides two independent, integrated graphics
processing units: an OpenGL® ES 2.0 3D graphics accelerator with a shader and a 2D graphics
accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to two displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller two CAN ports, ESAI audio interface,
and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, and PCIe-II).
• Automotive environment support—Each processor includes interfaces, such as two CAN ports, an
MLB150/50 port, an ESAI audio interface, and an asynchronous sample rate converter for
multichannel/multisource audio.
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Solo/6DualLite
Security Reference Manual (IMX6DQ6SDLSRM).
• Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors, Rev. 9, 11/2018
2
NXP Semiconductors


Part Number MCIMX6S6AVM08AB
Description Applications Processor
Maker NXP
Total Page 3 Pages
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