MCIMX6S6AVM10AD Datasheet | NXP Semiconductors

feature advanced implementation of single/dual Arm® Cortex®-A9 core, which operates at speeds of up to 1 GHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, 5 such as WLAN, Bluetooth®, GPS, hard drive, displays, and camera sensors. Introduction - - - - - - - .1 1.1 Ordering Information - - - - . . . .3 1.2 Features - - - - - - . . . .5 1.3 Updated Signal Naming Convention - - . .9 Architectural Overview - - - - - . .10 2.1 Block Diagram - - - - - . . .10 Modules List - - - - - - . . . . .11 3.1 Special Signal Considerations - - - .21 3.2 Remended Connections for Unused Analog Interfaces - - - - - - . .23 Electrical Characteristics - - - - . . . . .23 4.1 Chip-Level Conditions - - - - . .23 4.2 Power Supplies Requirements and Restrictions . .33 4.3 Integrated LDO Voltage Regulator Parameters . . .34 4.4 PLL’s Electrical Characteristics - - . . . . .36 4.5 On-Chip Oscillators - - - - . . . .38 4.6 I/O DC Parameters - - - - . . . . .39 4.7 I/O AC Parameters -...