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NXP Semiconductors Electronic Components Datasheet

MF1ICS5005 Datasheet

Standard Card IC

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INTEGRATED CIRCUITS
ADDENDUM
Standard Card IC
MF1 IC S50 05
Specification “bumped sawn wafer on UV-tape”
Product Specification
Revision 3.0
PUBLIC
August 2004
Philips
Semiconductors


NXP Semiconductors Electronic Components Datasheet

MF1ICS5005 Datasheet

Standard Card IC

No Preview Available !

Philips Semiconductors
Bumped sawn wafer on UV-tape
Product Specification Rev. 3.0 August 2004
Standard Card IC MF1 IC S50 05
CONTENTS
1 SCOPE............................................................................................................................. 3
2 REFERENCE DOCUMENTS.............................................................................................. 3
2.1 Philips Documents............................................................................................................. 3
3 MECHANICAL SPECIFICATION ........................................................................................ 3
3.1 Wafer................................................................................................................................ 3
3.2 Wafer Backside ................................................................................................................. 3
3.3 Chip Dimensions ............................................................................................................... 3
3.4 Passivation........................................................................................................................ 3
3.5 Au Bump........................................................................................................................... 3
4 ORDERING INFORMATION .............................................................................................. 3
4.1 Bumped die on sawn wafer ................................................................................................ 3
5 CHIP ORIENTATION AND BONDPAD LOCATIONS ........................................................... 4
6 ELECTRICAL SPECIFICATIONS ....................................................................................... 5
6.1 Absolute Maximum Ratings ................................................................................................ 5
6.2 AC Characteristics............................................................................................................. 5
7 DEFINITIONS ................................................................................................................... 6
8 LIFE SUPPORT APPLICATIONS ....................................................................................... 6
9 REVISION HISTORY ......................................................................................................... 6
Contact Information........................................................................................................................ 7
MIFARE® is a registered trademark of Philips Electronics N.V.
2
PUBLIC


Part Number MF1ICS5005
Description Standard Card IC
Maker NXP
Total Page 7 Pages
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