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NXP Semiconductors Electronic Components Datasheet

MIMX8MN3DVTJZAA Datasheet

Applications Processor

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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX8MNCEC
Rev. 0.1, 03/2020
MIMX8MN6DVTJZAA
MIMX8MN6DVTJZDA
MIMX8MN4DVTJZAA
MIMX8MN2DVTJZAA
MIMX8MN6DVTJZCA
MIMX8MN5DVTJZAA
MIMX8MN3DVTJZAA
MIMX8MN1DVTJZAA
i.MX 8M Nano
Applications Processor
Datasheet for Consumer
Products
Package Information
Plastic Package
FCBGA 14 x 14 mm, 0.5 mm pitch
Ordering Information
See Table 2 on page 6
1 i.MX 8M Nano introduction
The i.MX 8M Nano application processor represents 1. i.MX 8M Nano introduction . . . . . . . . . . . . . . . . . . . . . . . 1
NXP’s latest graphics and audio experience combining 1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
state-of-the-art
media-specific
features
with
2.
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
high-performance processing while optimized for lowest 2.1. Recommended connections for unused input/output
power consumption.
12
3. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
The i.MX 8M Nano family of processors features
advanced implementation of a quad Arm® Cor-
3.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14
3.2. Power supplies requirements and restrictions . . . 22
3.3. PLL electrical characteristics . . . . . . . . . . . . . . . . 26
tex®-A53 core, which operates at speeds of up to
3.4. On-chip oscillators . . . . . . . . . . . . . . . . . . . . . . . . 28
3.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 29
1.5 GHz. A general purpose Cortex®-M7 running up to
750 MHz core processor is for real-time and low-power
3.7. Output buffer impedance parameters . . . . . . . . . 31
3.8. System modules timing . . . . . . . . . . . . . . . . . . . . 33
3.9. External peripheral interface parameters . . . . . . 34
processing.
4. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 68
4.1. Boot mode configuration pins . . . . . . . . . . . . . . . 68
The i.MX 8M Nano family of processors provides addi- 4.2. Boot device interface allocation . . . . . . . . . . . . . . 68
tional computing resources and peripherals:
• Advanced security modules for secure boot,
cipher acceleration and DRM support
5. Package information and contact assignments . . . . . . . 70
5.1. 14 x 14 mm package information . . . . . . . . . . . . 70
5.2. DDR pin function list . . . . . . . . . . . . . . . . . . . . . . 85
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
• A wide range of audio interfaces, including I2S,
AC 97, TDM, and S/PDIF
• Large set of peripherals that are commonly used
in consumer/industrial market, including USB
and Ethernet
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.


NXP Semiconductors Electronic Components Datasheet

MIMX8MN3DVTJZAA Datasheet

Applications Processor

No Preview Available !

i.MX 8M Nano introduction
Subsystem
Cortex®-A53 MPCore platform
Cortex®-M7 core platform
Connectivity
On-chip memory
GPIO and pin multiplexing
Power management
Table 1. Features
Feature
Quad symmetric Cortex® -A53 processors
• 32 KB L1 Instruction Cache
• 32 KB L1 Data Cache
• Media Processing Engine (MPE) with Arm® NEONTM technology supporting the
Advanced Single Instruction Multiple Data architecture:
• Floating Point Unit (FPU) with support of the Arm® VFPv4-D16 architecture
Support of 64-bit Arm®v8-A architecture
512 KB unified L2 cache
Low power microcontroller available for customer application:
• low power standby mode
• IoT features including Weave
• Manage IR or wireless remote
• ML inference applications (enhanced for i.MX 8M Nano)
Cortex® M7 CPU:
• 256 KB tightly coupled memory (TCM)
One USB 2.0 OTG controllers with integrated PHY interfaces:
• Spread spectrum clock support
Three Ultra Secure Digital Host Controller (uSDHC) interfaces:
• MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec
• SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100
MB/sec
• Support for SDXC (extended capacity)
One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),
Ethernet AVB, and IEEE 1588
Four Universal Asynchronous Receiver/Transmitter (UART) modules
Four I2C modules
Three SPI modules
Boot ROM (256 KB)
On-chip RAM (512 KB + 32 KB)
General-purpose input/output (GPIO) modules with interrupt capability
Input/output multiplexing controller (IOMUXC) to provide centralized pad control
Temperature sensor with programmable trip points
Flexible power domain partitioning with internal power switches to support efficient
power management
i.MX 8M Nano Applications Processor Datasheet for Consumer Products, Rev. 0.1, 03/2020
2
NXP Semiconductors


Part Number MIMX8MN3DVTJZAA
Description Applications Processor
Maker NXP
Total Page 3 Pages
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