Table of Contents
1 Ordering parts...........................................................................4
6 Peripheral operating requirements and behaviors....................23
1.1 Determining valid orderable parts......................................4
6.1 Core modules....................................................................23
2 Part identification......................................................................4
6.1.1 Debug trace timing specifications.......................23
2.1 Description.........................................................................4
6.1.2 JTAG electricals..................................................24
2.2 Format...............................................................................4
6.2 System modules................................................................27
2.3 Fields.................................................................................4
6.3 Clock modules...................................................................27
2.4 Example............................................................................5
6.3.1 MCG specifications.............................................27
3 Terminology and guidelines......................................................5
6.3.2 Oscillator electrical specifications.......................29
3.1 Definition: Operating requirement......................................5
6.3.3 32 kHz oscillator electrical characteristics..........32
3.2 Definition: Operating behavior...........................................6
6.4 Memories and memory interfaces.....................................32
3.3 Definition: Attribute............................................................6
6.4.1 Flash electrical specifications.............................32
3.4 Definition: Rating...............................................................7
6.4.2 EzPort switching specifications...........................34
3.5 Result of exceeding a rating..............................................7
6.4.3 Flexbus switching specifications.........................35
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................38
requirements......................................................................7
6.6 Analog...............................................................................38
3.7 Guidelines for ratings and operating requirements............8
6.6.1 ADC electrical specifications..............................38
3.8 Definition: Typical value.....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications......46
3.9 Typical value conditions....................................................9
6.6.3 12-bit DAC electrical characteristics...................49
4 Ratings......................................................................................10
6.6.4 Voltage reference electrical specifications..........52
4.1 Thermal handling ratings...................................................10
6.7 Timers................................................................................53
4.2 Moisture handling ratings..................................................10
6.8 Communication interfaces.................................................53
4.3 ESD handling ratings.........................................................10
6.8.1 USB electrical specifications...............................53
4.4 Voltage and current operating ratings...............................10
6.8.2 USB DCD electrical specifications......................54
5 General.....................................................................................11
6.8.3 USB VREG electrical specifications...................54
5.1 AC electrical characteristics..............................................11
6.8.4 CAN switching specifications..............................55
5.2 Nonswitching electrical specifications...............................11
6.8.5 DSPI switching specifications (limited voltage
5.2.1 Voltage and current operating requirements......12
range).................................................................55
5.2.2 LVD and POR operating requirements...............13
6.8.6 DSPI switching specifications (full voltage
5.2.3 Voltage and current operating behaviors............13
range).................................................................56
5.2.4 Power mode transition operating behaviors.......15
6.8.7 Inter-Integrated Circuit Interface (I2C) timing..... 58
5.2.5 Power consumption operating behaviors............16
6.8.8 UART switching specifications............................59
5.2.6 EMC radiated emissions operating behaviors....19
6.8.9 SDHC specifications...........................................59
5.2.7 Designing with radiated emissions in mind.........20
6.8.10 I2S/SAI switching specifications.........................60
5.2.8 Capacitance attributes........................................20
6.9 Human-machine interfaces (HMI)......................................67
5.3 Switching specifications.....................................................20
6.9.1 TSI electrical specifications................................67
5.3.1 Device clock specifications.................................20
7 Dimensions...............................................................................68
5.3.2 General switching specifications.........................21
7.1 Obtaining package dimensions.........................................68
5.4 Thermal specifications.......................................................22
8 Pinout........................................................................................68
5.4.1 Thermal operating requirements.........................22
8.1 K20 signal multiplexing and pin assignments....................68
5.4.2 Thermal attributes...............................................22
8.2 K20 pinouts.......................................................................72
K20 Sub-Family Data Sheet, Rev. 3, 6/2013.
2
Freescale Semiconductor, Inc.
