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NXP Semiconductors Electronic Components Datasheet

MPC5746R Datasheet

Microcontroller

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NXP Semiconductors
Data Sheet: Technical Data
SPC5746R Microcontroller
Data Sheet
Features
• This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5746R
series of microcontroller units (MCUs).
Document Number MPC5746R
Rev. 7, 02/2020
MPC5746R
• For functional characteristics, see the MPC5746R
Microcontroller Reference Manual.
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.


NXP Semiconductors Electronic Components Datasheet

MPC5746R Datasheet

Microcontroller

No Preview Available !

Table of Contents
1 Introduction........................................................................................ 3
17.2 Flash memory Array Integrity and Margin Read
1.1 Block diagram......................................................................... 3
specifications........................................................................... 55
2 Package pinouts and signal descriptions............................................ 5
17.3 Flash memory module life specifications................................55
3 Absolute maximum ratings................................................................ 6
17.4 Data retention vs program/erase cycles...................................56
4 Electromagnetic Compatibility (EMC).............................................. 7
17.5 Flash memory AC timing specifications.................................57
5 Electrostatic discharge (ESD)............................................................ 7
17.6 Flash read wait state and address pipeline control settings.....58
6 Operating conditions.......................................................................... 8
18 AC specifications............................................................................... 58
7 DC electrical specifications................................................................11
18.1 Debug and calibration interface timing...................................58
8 I/O pad specification.......................................................................... 12
18.1.1 JTAG interface timing............................................ 58
8.1 Input pad specifications...........................................................12
18.1.2 Nexus interface timing............................................61
8.2 Output pad specifications........................................................ 15
18.1.3 Aurora LVDS interface timing............................... 63
8.3 I/O pad current specifications................................................. 17
18.2 DSPI timing with CMOS and LVDS...................................... 65
9 Reset pad (PORST, RESET) electrical characteristics...................... 18
18.2.1 DSPI master mode full duplex timing with CMOS
10 Oscillator and FMPLL....................................................................... 22
and LVDS pads....................................................... 66
11 ADC modules.....................................................................................26
18.2.2 DSPI CMOS slave mode........................................ 78
11.1 ADC input description............................................................ 26
18.3 FEC timing.............................................................................. 80
11.2 SAR ADC................................................................................26
18.3.1 MII-lite receive signal timing (RXD[3:0],
11.3 S/D ADC................................................................................. 29
RX_DV, RX_ER, and RX_CLK)...........................80
12 Temperature sensor............................................................................ 39
18.3.2 MII-lite transmit signal timing (TXD[3:0],
13 LVDS fast asynchronous serial transmission (LFAST) pad
TX_EN, TX_ER, TX_CLK)...................................81
electrical characteristics..................................................................... 40
18.3.3 MII-lite async inputs signal timing (CRS and
13.1 LFAST interface timing diagrams...........................................40
COL)....................................................................... 82
13.2 LFAST and MSC /DSPI LVDS interface electrical
18.3.4 MII-lite serial management channel timing
characteristics.......................................................................... 42
(MDIO and MDC).................................................. 82
14 LFAST PLL electrical characteristics................................................45
18.3.5 RMII serial management channel timing (MDIO
15 Aurora LVDS electrical characteristics............................................. 46
and MDC)............................................................... 83
16 Power management PMC POR LVD sequencing..............................47
18.3.6 RMII receive signal timing (RXD[1:0], CRS_DV)84
16.1 Power management electrical characteristics..........................47
18.3.7 RMII transmit signal timing (TXD[1:0], TX_EN). 85
16.1.1 Recommended power transistors............................ 47
18.4 UART timings......................................................................... 86
16.1.2 Power management integration.............................. 48
18.5 eMIOS timing..........................................................................86
16.1.3 Regulator example for the NJD2873 transistor...... 50
19 Obtaining package dimensions.......................................................... 86
16.1.4 Regulator example for the 2SCR574d transistor.... 51
20 Thermal characteristics...................................................................... 87
16.1.5 Device voltage monitoring......................................51
20.1 General notes for specifications at maximum junction
16.1.6 Power up/down sequencing.................................... 53
temperature..............................................................................89
17 Flash memory specifications..............................................................54
21 Ordering information......................................................................... 90
17.1 Flash memory program and erase specifications.................... 54
22 Revision history................................................................................. 91
SPC5746R Microcontroller Data Sheet, Rev. 7, 02/2020
2
NXP Semiconductors


Part Number MPC5746R
Description Microcontroller
Maker NXP
Total Page 3 Pages
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