900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf




NXP Semiconductors Electronic Components Datasheet

MPXV7002G Datasheet

Integrated Silicon Pressure Sensor

No Preview Available !

MPXV7002
Integrated silicon pressure sensor, on-chip signal
conditioned, temperature compensated and calibrated
Rev. 5 — 5 May 2021
Product data sheet
1 General description
The MPXV7002 series piezoresistive transducers are monolithic silicon pressure
sensors. The MPXV7002 is designed for a wide range of applications, particularly
applications employing a microcontroller, or microprocessor with analog-to-digital inputs.
This transducer combines advanced micromachining techniques, thin-film metallization,
and bipolar processing to provide an accurate, high-level analog output signal that is
proportional to the applied pressure.
2 Features and benefits
Ideally suited for microprocessor or microcontroller-based systems
Thermoplastic (PPS) surface mount package
Temperature compensated over +10 °C to +60 °C
Patented silicon shear stress strain gauge
Available in differential and gauge configurations
3 Applications
Hospital beds
HVAC
Respiratory systems
Process control
4 Ordering information
Table 1. Ordering information
Type number Package
Name Description
MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x
7.62 mm body
Version
SOT1693-1
MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1
12.96 mm body
MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3
8.38 mm body


NXP Semiconductors Electronic Components Datasheet

MPXV7002G Datasheet

Integrated Silicon Pressure Sensor

No Preview Available !

NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated
4.1 Ordering options
Table 2. Ordering options
Device name
Package
options
SOT
no.
# of Ports
None Single Dual
Small Outline Package (MPXV7002 Series)
MPXV7002DP
Trays SOT1693-1
MPXV7002DPT1 Tape & Reel SOT1693-1
MPXV7002GC6U
Rails
SOT1854-1
MPXV7002GP
Trays SOT1693-3
Pressure type
Gauge Differential Absolute
Device
marking
MPXV7002DP
MPXV7002DP
MPXV7002G
MPXV7002G
Small outline packages
MPXV7002DP/DPT1
CASE 1351-01
SOT1693-1
5 Block diagram
MPXV7002GC6U/C6T1
CASE 482A-01
SOT1854-1
VS
2
MPXV7002GP
CASE 1369-01
SOT1693-3
Sensing
element
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
4
Vout
3
GND
Pins 1, 5, 6, 7 and 8 are NO CONNECTS
for small outline package device
Figure 1. Integrated pressure sensor schematic
aaa-040606
MPXV7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 5 May 2021
© NXP B.V. 2021. All rights reserved.
2 / 18


Part Number MPXV7002G
Description Integrated Silicon Pressure Sensor
Maker NXP
PDF Download

MPXV7002G Datasheet PDF






Similar Datasheet

1 MPXV7002 Integrated Silicon Pressure Sensor
NXP
2 MPXV7002 Integrated Silicon Pressure Sensor
Freescale Semiconductor
3 MPXV7002DP Integrated Silicon Pressure Sensor
NXP
4 MPXV7002G Integrated Silicon Pressure Sensor
NXP
5 MPXV7002GC Integrated Silicon Pressure Sensor
NXP
6 MPXV7002GC6T1 Integrated Silicon Pressure Sensor
NXP
7 MPXV7002GC6U Integrated Silicon Pressure Sensor
NXP
8 MPXV7002GP Integrated Silicon Pressure Sensor
NXP





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z



Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy