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NXP Semiconductors Electronic Components Datasheet

NX20P0407 Datasheet

CC and SBU Protection

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NX20P0407
USB Type-C CC and SBU Protection IC
Rev. 1.3 — 22 August 2019
Product data sheet
1 General description
The NX20P0407 is a single-chip USB Type-C port protection device that provides 28V
short-to-VBUS overvoltage protection to CC1/CC2 and SBU1/SBU2 pins.
USB Type-C allows VBUS voltage to increase up to 20V through Power delivery protocol.
CC1/2 and SBU1/2 pins can be shorted to VBUS due to mechanical twisting and sliding
of the connector since Type-C connector contact pins are 25% closer to each other than
a micro USB connector. Moisture or fine dust may also cause the 20V VBUS pin to be
shorted to adjacent pins.
NX20P0407 enables CC and SBU pins to be more robust in even abnormal conditions.
NX20P0407 is 28V DC tolerant on CON_CC1, CON_CC2, CON_SBU1 and CON_SBU2
pins in connector side and quickly disconnects switches if the voltage is above
overvoltage threshold, protecting CC1, CC2, SBU1 and SBU2 in system side from high
voltage.
NX20P0407 integrates IEC 61000-4-2 ESD protection on CON_CC1 and CON_CC2,
+15KV air discharge and +8KV contact discharge, which helps to reduce external BOM
cost. NX20P0407 CON_CC1/2 pins are designed to be protected from surges up to +/-
35V.
2 Features and benefits
USB Type C CC1/2 and SBU1/2 short protection to VBUS
CON_CC1 / CON_CC2 : 28VDC
CON_SBU1 / CON_SBU2 : 28VDC
Rd circuit in CON_CC1/CON_CC2 in dead battery
Low RDSon switch
CC switch : 160mΩ
SBU switch : 3.6Ω
Robust ESD immunity for CON_CC1/2
IEC 61000-4-2 Contact discharge: 8KV
IEC 61000-4-2 Air discharge: 15KV
+/- 35V surge protection on CON_CC1/2
Low SYS leakage current : 32μA
CC1/2 leakage current : < 1μA
Fast OVP turn off time : 60ns


NXP Semiconductors Electronic Components Datasheet

NX20P0407 Datasheet

CC and SBU Protection

No Preview Available !

NXP Semiconductors
NX20P0407
USB Type-C CC and SBU Protection IC
3 Applications
Smartphone
Tablet
Laptop
4 Ordering information
Table 1. Ordering information
Type number
Topside
marking
NX20P0407UK N07
Package
Name
WLCSP12
Description
Version
Wafer level chip-scale package, 12 bumps; 1.67 SOT1390-7
mm x 1.27 mm x 0.525 mm body (backside
coating included)
4.1 Ordering options
Table 2. Ordering options
Type number Orderable part
number
NX20P0407UK NX20P0407UKAZ
NX20P0407UKZ
Package
WLCSP12
WLCSP12
Packing method
Minimum
Temperature
order quantity
REEL 7" Q1/T1 DP 4000
CHIPS
Tamb = -40 °C to +85 °C
REEL 13" Q1/T1 DP 15000
CHIPS
Tamb = -40 °C to +85 °C
NX20P0407
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.3 — 22 August 2019
© NXP B.V. 2019. All rights reserved.
2 / 18


Part Number NX20P0407
Description CC and SBU Protection
Maker NXP
Total Page 3 Pages
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