NXH5104 Key Features
- pact wafer-level chip-scale package (WLCSP) package
- 7.8 mm2, 380 μm thick
- 13 bumps with 400 μm pitch
- Integrated power management unit (PMU)
- VDD supply range 1.0 V to 2.0 V
- VDD(IO) supply range: VDD to 2.6 V
- Direct operation from ZnAir, NiMH, Silver-Zinc batteries
- Active peak current limiting
- Low current consumption
- Average power down current < 5 μA