NXH5104 eeprom equivalent, 4 mbit serial spi eeprom.
* Compact wafer-level chip-scale package (WLCSP) package
*
– 7.8 mm2, 380 μm thick
– 13 bumps with 400 μm pitch
* Integrated p.
and is provided with a serial peripheral interface (SPI) compatible interface.
2 Features and benefits
* Compact waf.
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