DSP software features GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FUNCTIONAL DESCRIPTION PACKAGE OUTLINE SOLDERING .
PURCHASE OF PHILIPS I2C COMPONENTS
PCD5093
1997 Jul 21
2
Philips Semiconductors
Objective specification
DECT baseba.
ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FUNCTIONAL DESCRIPTION PACKAGE OUTLINE SOLDERING Introduction Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF P.
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