PRTR5V0U2D Datasheet | NXP Semiconductors

description Ultra low capacitance double rail-to-rail Electro Static Discharge (ESD) protection device in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package. The device is designed to protect two Hi-Speed data lines or high-frequency signal lines from the damage caused by ESD and other transients. PRTR5V0U2D integrates two ultra low capacitance rail-to-rail ESD protection channels and one additional ESD protection diode to ensure signal line protection even if no supply voltage is available. 1.2 Features I I I I I I I I ESD protection of two Hi-Speed data lines or high-frequency signal lines Ultra low input/output to ground capacitance: C(I/O-GND) = 1 p F ESD protection up to 8 k V IEC 61000-4-2, level 4 (ESD) Very low clamping voltage due to an integrated additional ESD protection diode Very low reverse current AEC-Q101 qualified (85 °C) Small SMD plastic package 1.3 Applications I I I I I I I I USB 2.0 interfaces Digital Video Interface (DVI) High Definition Multimedia Interface (HDMI) Mobile and cordless phones Personal Digital Assistants (PDA) Digital cameras Wide Area Network (WAN) / Local Area Network (LAN) systems PCs, notebooks, printers and other PC peripherals .. NXP Semiconductors Ultra low capacitance double rail-to-rail ESD protection 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 °C unless otherwise specified. Symbol Per channel C(I/O-GND) C(I/O-I/O) Zener diode VRWM Csup [1] [2] [3] Parameter input/output to ground capacitance input/output to input/output capacitance reverse standoff voltage supply pin to ground capacitance Conditions f = 1 MHz; V(I/O-GND) = 0 V f = 1 MHz; V(I/O-I/O) = 0 V [1] Min - Typ 1.0 0.6 Max 1.5 - Unit p F p F [2] [3] - 16 - V p F f = 1 MHz; VCC = 0 V [3] Measured from pin 1, 3, 4 or 6 to ground. Measured from pin 1 or 6 to pin 3 or 4. Measured from pin 5 to ground. 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description input/output 1 ground...