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NXP Semiconductors Electronic Components Datasheet

SSTUM32865 Datasheet

1.8 V 28-bit 1 : 2 registered buffer

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SSTUM32865
1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800
RDIMM applications
Rev. 01 — 19 September 2007
Product data sheet
1. General description
The SSTUM32865 is a 1.8 V 28-bit 1 : 2 register specifically designed for use on two rank
by four (2R × 4) and similar high-density Double Data Rate 2 (DDR2) memory modules. It
is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the
functionality of the normally required two registers in a single package, thereby freeing up
board real-estate and facilitating routing to accommodate high-density Dual In-line
Memory Module (DIMM) designs.
The SSTUM32865 also integrates a parity function, which accepts a parity bit from the
memory controller, compares it with the data received on the D-inputs and indicates
whether a parity error has occurred on its open-drain PTYERR pin (active LOW).
It further offers added features over the JEDEC standard register in that it is permanently
configured for high output drive strength. This allows use in high density designs with
heavier than normal net loading conditions. Furthermore, the SSTUM32865 features two
additional chip select inputs, which allow more versatile enabling and disabling in densely
populated memory modules. Both added features (drive strength and chip selects) are
fully backward compatible to the JEDEC standard register.
The SSTUM32865 is packaged in a 160-ball, 12 × 18 grid, 0.65 mm ball pitch, thin profile
fine-pitch ball grid array (TFBGA) package, which, while requiring a minimum
9 mm × 13 mm of board space, allows for adequate signal routing and escape using
conventional card technology.
2. Features
I 28-bit data register supporting DDR2
I Fully compliant to JEDEC standard for SSTUB32865
I Supports 2 rank by 4 DIMM density by integrating equivalent functionality of two
JEDEC-standard DDR2 registers (that is, 2 × SSTUB32864 or 2 × SSTUB32866)
I Parity checking function across 22 input data bits
I Parity out signal
I Controlled multi-impedance output impedance drivers enable optimal signal integrity
and speed
I Meets or exceeds SSTUB32865 JEDEC standard speed performance
I Supports up to 450 MHz clock frequency of operation
I Permanently configured for high output drive
I Optimized pinout for high-density DDR2 module design
I Chip-selects minimize power consumption by gating data outputs from changing state
I Two additional chip select inputs allow optional flexible enabling and disabling


NXP Semiconductors Electronic Components Datasheet

SSTUM32865 Datasheet

1.8 V 28-bit 1 : 2 registered buffer

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NXP Semiconductors
SSTUM32865
1.8 V DDR2-800 registered buffer with parity
I Supports Stub Series Terminated Logic SSTL_18 data inputs
I Differential clock (CK and CK) inputs
I Supports LVCMOS switching levels on the control and RESET inputs
I Single 1.8 V supply operation (1.7 V to 2.0 V)
I Available in 160-ball 9 mm × 13 mm, 0.65 mm ball pitch TFBGA package
3. Applications
I 400 MT/s to 800 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
I DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
4. Ordering information
Table 1. Ordering information
Type number
Solder process
Package
Name
Description
Version
SSTUM32865ET/G Pb-free (SnAgCu solder ball TFBGA160 plastic thin fine-pitch ball grid array package; SOT802-2
compound)
160 balls; body 9 × 13 × 0.7 mm
SSTUM32865ET/S Pb-free (SnAgCu solder ball TFBGA160 plastic thin fine-pitch ball grid array package; SOT802-2
compound)
160 balls; body 9 × 13 × 0.7 mm
4.1 Ordering options
Table 2. Ordering options
Type number
Topside mark
SSTUM32865ET/G SSTUM32865ET
SSTUM32865ET/S
SSTUM32865ETS
Temperature range
Tamb = 0 °C to +70 °C
Tamb = 0 °C to +85 °C
SSTUM32865_1
Product data sheet
Rev. 01 — 19 September 2007
© NXP B.V. 2007. All rights reserved.
2 of 28


Part Number SSTUM32865
Description 1.8 V 28-bit 1 : 2 registered buffer
Maker NXP
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