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NXP Semiconductors Electronic Components Datasheet

TEF6890H Datasheet

Car radio integrated signal processor

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INTEGRATED CIRCUITS
DATA SHEET
TEF6890H
Car radio integrated signal
processor
Product speciļ¬cation
2003 Oct 21


NXP Semiconductors Electronic Components Datasheet

TEF6890H Datasheet

Car radio integrated signal processor

No Preview Available !

Philips Semiconductors
Car radio integrated signal processor
Product speciļ¬cation
TEF6890H
CONTENTS
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.4.1
7.4.2
7.5
7.6
7.6.1
7.6.2
7.6.3
7.6.4
7.6.5
7.6.6
7.6.7
7.7
8
9
10
11
FEATURES
General
I2C-bus
Stereo decoder
Noise blanking
Weak signal processing
RDS demodulator
Tone/volume part
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM and AM noise blanker
High cut control and de-emphasis
Noise detector
FM noise detector
AM noise detector
Multipath/weak signal processing
Tone/volume control
Input selector
Loudness
Volume/balance
Treble
Bass
Fader/mute
Beep generator and NAV input with output
mixer
RDS demodulator
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I2C-BUS PROTOCOL
11.1
11.1.1
11.1.2
11.1.3
11.2
11.2.1
11.2.2
11.2.3
11.2.4
11.2.5
11.2.6
11.2.7
11.2.8
11.2.9
11.2.10
11.2.11
11.2.12
11.2.13
11.2.14
11.2.15
11.2.16
11.2.17
11.2.18
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
Read mode
Data byte 1; STATUS
Data byte 2; LEVEL
Data byte 3; USN and WAM
Write mode
Subaddress 2H; RDSCLK
Subaddress 4H; CONTROL
Subaddress 5H; CSALIGN
Subaddress 6H; MULTIPATH
Subaddress 7H; SNC
Subaddress 8H; HIGHCUT
Subaddress 9H; SOFTMUTE
Subaddress AH; RADIO
Subaddress BH; INPUT and ASI
Subaddress CH; LOUDNESS
Subaddress DH; VOLUME
Subaddress EH; TREBLE
Subaddress FH; BASS
Subaddress 10H; FADER
Subaddress 11H; BALANCE
Subaddress 12H; MIX
Subaddress 13H; BEEP
Subaddress 1FH; AUTOGATE
TEST AND APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I2C COMPONENTS
2003 Oct 21
2


Part Number TEF6890H
Description Car radio integrated signal processor
Maker NXP
Total Page 30 Pages
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