Download PMPB27EP Datasheet PDF
PMPB27EP page 2
Page 2
PMPB27EP page 3
Page 3

PMPB27EP Key Features

  • Trench MOSFET technology
  • Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
  • Exposed drain pad for excellent thermal conduction
  • Tin-plated 100 % solderable side pads for optical solder inspection 1.3