Datasheet4U Logo Datasheet4U.com

TDA8928J Datasheet Power stage 2 x 10 or 1 x 20 W class-D audio amplifie

Manufacturer: NXP Semiconductors

General Description

QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power stage Protection Maximum temperature Maximum current LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS 18 19 20 15 15.1 15.2 15.3 15.4 15.4.1 15.4.2 15.5 16 17 17.1 17.2 17.3 17.4 TDA8928J TEST AND APPLICATION INFORMATION SE application Package ground connection Output power Reference design Printed-circuit board Bill of materials Curves measured in reference design PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2004 May 05 2 Philips Semiconductors www.DataSheet4U.com Preliminary specification Power stage 2 x 10 or 1 x 20 W class-D audio amplifier 1

Overview

INTEGRATED CIRCUITS www.DataSheet4U.com DATA SHEET TDA8928J Power stage 2 x 10 or 1 x 20 W class-D audio amplifier Preliminary specification Supersedes data of 2004 Feb 04 2004 May 05 Philips Semiconductors www.DataSheet4U.com Preliminary specification Power stage 2 x 10 or 1 x 20 W class-D audio amplifier CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.