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OSD3358-512M-BAS Datasheet Preview

OSD3358-512M-BAS Datasheet

MicroProcessor

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Introduction
The OSD335x Family of System-In-
Package (SIP) products are building blocks
designed to allow easy and cost-effective
implementation of systems based on Texas
Instruments’ powerful Sitara™ AM335x line
of processors. The OSD335x integrates the
AM335x along with the TI TPS65217C
PMIC, the TI TL5209 LDO, up to 1 Gigabyte
of DDR3 Memory, and resistors, capacitors,
and inductors all into a single 27mm x
27mm design-in-ready package.
With this level of integration, the OSD335x
Family of SIPs allows designers to focus on
the key aspects of their system without
spending time on the complicated high-
speed design of the processor/DDR3
interface or the PMIC power distribution. It
also reduces the overall size and complexity
of the design and the supply chain. The
OSD335x can significantly decrease the
time to market for AM335x-based products.
Features
TI AM335x, TPS65217C, TL5209,
DDR3, and over 140 Passive
components integrated into a single
package
TI AM335x Features:
o ARM® Cortex®-A8 up to 1GHz
o 8 channel 12-bit SAR ADC
o Ethernet 10/100/1000 x2
o USB 2.0 HS OTG + PHY x2
o MMC, SD and SDIO x2
o LCD Controller
o SGX 3D Graphics Engine
o PRU Subsystem
Access to All AM335x Peripherals:
CAN, SPI, UART, I2C, GPIO, etc.
Up to 1GB DDR3
PWR In: AC Adapter, USB or Single
cell (1S) Li-Ion / Li-Po Battery
OSD335x BAS/IND Datasheet
Rev. 16 1/1/2021
OSD335x Block Diagram
PWR Out: 1.8V, 3.3V and SYS
AM335x I/O Voltage: 3.3V
Benefits
Integrates over 100 components into
one package
Compatible with AM335x
development tools and software
Wide BGA ball pitch allows for low-
cost assembly.
Significantly reduces design time
Decreases layout complexity
35% reduction in board space vs
discrete implementation
Increased reliability through reduced
number of components
Package
400 Ball BGA (27mm X 27mm)
20 X 20 grid, 1.27mm pitch
Temp Range: 0 to 85°C, -40 to 85°C
Octavo Systems LLC
Copyright 2016-2021




OCTAVO

OSD3358-512M-BAS Datasheet Preview

OSD3358-512M-BAS Datasheet

MicroProcessor

No Preview Available !

2
OSD335x BAS/IND Datasheet
Rev. 16 1/1/2021
Table of Contents
1 Revision History ....................................................................................... 4
2 Block Diagram ......................................................................................... 5
2.1 Passives ........................................................................................... 6
2.1.1 Additional Required Bulk Capacitance .................................................. 6
2.1.2 Integrated Bulk Capacitance ............................................................. 6
2.1.3 Integrated Resistors........................................................................ 7
3 Product Number Information ........................................................................ 8
4 Reference Documents ............................................................................... 10
4.1 Data Sheets ...................................................................................... 10
4.2 Other Reference ................................................................................ 10
5 Ball Map ............................................................................................... 11
5.1 Ball Description ................................................................................. 17
5.2 AM335x Relocated Signals ..................................................................... 20
5.3 Not Connected Balls ............................................................................ 20
5.4 Reserved Signals ................................................................................ 21
6 OSD335x Components ............................................................................... 22
6.1 AM335x Processor............................................................................... 22
6.1.1 I/O Voltages................................................................................ 22
6.2 DDR3 Memory.................................................................................... 22
7 Power Management .................................................................................. 24
7.1 Input Power...................................................................................... 24
7.1.1 VIN_AC ...................................................................................... 24
7.1.2 VIN_USB..................................................................................... 24
7.1.3 VIN_BAT..................................................................................... 24
7.2 Output Power ................................................................................... 24
7.2.1 SYS_VOUT: Switched VIN_AC, VIN_USB, or VIN_BAT ................................. 24
7.2.2 SYS_VDD1_3P3V............................................................................ 25
7.2.3 SYS_VDD2_3P3V............................................................................ 25
7.2.4 SYS_RTC_1P8V ............................................................................. 25
7.2.5 SYS_VDD_1P8V ............................................................................. 25
7.2.6 SYS_ADC_1P8V ............................................................................. 25
Octavo Systems LLC
Copyright 2016-2021


Part Number OSD3358-512M-BAS
Description MicroProcessor
Maker OCTAVO
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OSD3358-512M-BAS Datasheet PDF






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