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OSD3358-512M-BCB Datasheet Preview

OSD3358-512M-BCB Datasheet

1GHz Sitara ARM Cortex-A8 Processor

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OSD335x C-SiP Family
Rev. 6 6/23/2021
Introduction
The OSD335x C-SiP System-In-Package
(SiP) is a self-contained computing system
ideal to power the latest embedded
applications. It integrates the powerful
1GHz Sitara™ ARM® Cortex®-A8 AM335x
Processor from Texas Instruments, up to 1
Gigabyte (GB) of DDR3L memory, up to 16
Gigabytes (GB) of embedded Multimedia
Card (eMMC) non-volatile memory, a low
power, low jitter MEMs Oscillator, 4
Kilobytes (KB) EEPROM, TPS65217C
PMIC, TL5209 LDO, and resistors,
capacitors, and inductors into a single
27mm x 27mm easy to use IC package.
With this level of integration, the OSD335x
C-SiP has everything needed to build a
complete embedded computing platform. It
allows designers to focus on the key
aspects of their system without spending
time on the complications associated with
getting the processing core working. It also
reduces the overall size and complexity of
the design while simplifying the supply
chain. The OSD335x C-SiP can
significantly decrease the time to market for
any embedded computing products.
Features
TI AM335x, TPS65217C, TL5209,
DDR3, EEPROM, eMMC, MEMS
Oscillator and passive components
integrated into a single package
TI AM335x Features:
o ARM® Cortex®-A8 up to 1GHz
o 8 channel 12-bit SAR ADC
o Ethernet 10/100/1000 x 2
o USB 2.0 HS OTG + PHY x2
o MMC, SD and SDIO x3
o LCD Controller
o SGX 3D Graphics Engine
o PRU Subsystem
OSD335x C-SiP Block Diagram
Access to all* AM335x Peripherals:
CAN, SPI, UART, I2C, GPIO, etc.
Up to 1GB DDR3
Up to 16GB eMMC
Low Power, Low Jitter MEMS Oscillator
PWR In: AC Adapter, USB or Single cell
(1S) Li-Ion / Li-Po Battery
PWR Out: 1.8V, 3.3V and SYS
Selectable I/O Voltage: 1.8V or 3.3V
Benefits
Integrates over 100 components
Compatible with AM335x development
tools and software
Significantly reduces design time
45% reduction in board space vs
discrete implementation
Decreases layout complexity
Wide BGA ball pitch allows for low-cost
assembly
Simplifies component sourcing
Increased reliability through reduced
number of components
Package
400 Ball BGA (27mm X 27mm)
20 X 20 grid, 1.27mm pitch
Temp Range: 0 to 85°C, -40 to 85°C
* Access to All IO except those used for communicating with the eMMC
Octavo Systems LLC
Copyright 2019 - 2021




OCTAVO

OSD3358-512M-BCB Datasheet Preview

OSD3358-512M-BCB Datasheet

1GHz Sitara ARM Cortex-A8 Processor

No Preview Available !

2
OSD335x C-SiP Family
Rev. 6 6/23/2021
Table of Contents
1 Revision History ....................................................................................... 4
2 Block Diagram ......................................................................................... 5
2.1 Passives ........................................................................................... 6
2.1.1 Additional Required Bulk Capacitance .................................................. 6
2.1.2 Integrated Bulk Capacitance ............................................................. 6
2.1.3 Integrated Resistors........................................................................ 7
3 Product Number Information ........................................................................ 8
4 Reference Documents ............................................................................... 10
4.1 Data Sheets ...................................................................................... 10
4.2 Other References ............................................................................... 10
5 Ball Map ............................................................................................... 11
5.1 Ball Description ................................................................................. 17
5.2 Internal Use Only AM335x Signal Pins ........................................................ 20
5.3 Not Connected Balls ............................................................................ 21
5.4 Reserved Signals ................................................................................ 21
6 OSD335x C-SiP Components ........................................................................ 22
6.1 AM335x Processor............................................................................... 23
6.1.1 I/O Voltages................................................................................ 23
6.1.2 Reset Circuitry ............................................................................. 23
6.2 DDR3 Memory.................................................................................... 24
6.3 MEMS Oscillator ................................................................................. 25
6.4 eMMC ............................................................................................. 26
6.4.1 Powering the eMMC ....................................................................... 26
6.4.2 Booting from the eMMC................................................................... 26
6.5 EEPROM .......................................................................................... 27
6.5.1 EEPROM Contents ......................................................................... 27
6.5.2 EEPROM Write Protection ................................................................ 27
7 Power Management .................................................................................. 28
7.1 Input Power...................................................................................... 28
7.1.1 VIN_AC ...................................................................................... 28
7.1.2 VIN_USB..................................................................................... 28
Octavo Systems LLC
Copyright 2019 - 2021


Part Number OSD3358-512M-BCB
Description 1GHz Sitara ARM Cortex-A8 Processor
Maker OCTAVO
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