KDV Series
Metal Film Low-Resistance Chip Resistor
Test
Temp. Coefficient of
Resistance (T.C.R.)
Short Time Overload
Insulation
Resistance
Solderability
Resistance to
Soldering Heat
Leaching
Temperature Cycling
High Temperature
Exposure
Resistance to
Solvent
Load Life in
Humidity
Load Life
(Endurance)
Terminal Bending
Strength
performance data
Method
Procedure
JIS C 5201-1, clause 4.8 TCR +125°C, 25°C is the reference temperature
JIS C 5201-1, clause 4.13
JIS C 5201-1, clause 4.6
Standard power: 6.25 times rated power whichever
is less for 5 seconds
High power (2X/4X): 5 times rated power whichever
is less for 5 seconds.
100V for 1 minute.
JIS C 5201-1, clause 4.17 245 ±5°C for 3 ±0.5secs.
JIS-C5201-1, clause 4.18 260 ±5°C for 10 seconds.
JIS-C5201-1, clause 4.18
JIS C 5201-1, clause 4.19
JIS-C5201-1 4.25
260 ±5°C for 30 seconds.
-55°C to +155°C, 300 cycles
155 ±5°C for 1000 +48/-0 hours.
JIS C 5201-1, clause 4.29
JIS C 5201-1 clause 4.24
JIS C 5201-1 clause 4.25
JIS C 5201-1, clause 4.33
The tested resistor be immersed into isopropyl alco-
hol of 20~25°C for 60 secs. Then the resistor is left
in the room for 48 hrs.
40±2°C, 90~95% R.H. , Rated power or Max. work-
ing current whichever is less for 1000 hrs with 1.5
hrs ON and 0.5 hr OFF.
70±2°C, Rated power, or Max. working current
whichever is less for 1000 hrs with 1.5 hrs ON and
0.5 hr OFF.
Bending once for 5 seconds: 0402, 0603, 0805 =
5mm; 1206, 1210 = 3mm; 2010, 2512 = 2mm
Requirements
Refer to Standard Electrical
Specifications
±(1.0%+0.001Ω)
≥10GΩ
>95% Coverage, No visible damage
±(1.0%+0.001Ω), No visible damage
>95% Coverage, No visible damage
±(1.0%+0.001Ω), No visible damage
±(1.0%+0.001Ω)
±(1.0%+0.001Ω), No visible damage
±(1.0%+0.001Ω)
±(1.0%+0.001Ω)
±(1.0%+0.001Ω), No visible damage
Wave solder
Temp. (°C)
180°
Peak: 260°C +5/-0
230°C or higher
150°
Pre-heating zone
90 sec. ±30
Soldering zone
30 sec. ±10
Time (sec.)
soldering
Solder reflow
Temp. (°C)
260°
235°
260°C / 10 sec.
Second wave
First wave
~200K/sec.
~5K/sec.
130°
100°
Forced
cooling
~2K/sec.
~2K/sec.
Rework temperature (hot air equipment):
350℃, 3~5seconds
Recommended reflow methods:
IR, vapor phase oven, hot air oven
If reflow temperatures exceed the recom-
mended profile, devices may not meet the
performance requirements.
Time (sec.)
0 50 100 150 200 250
rev 7/19-2
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