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MSC23136DL - DRAM-MODULE

Download the MSC23136DL datasheet PDF. This datasheet also covers the MSC23136D variant, as both devices belong to the same dram-module family and are provided as variant models within a single manufacturer datasheet.

General Description

The MSC23136D/DL-xxBS10/DS10 is a fully decoded, 1,048,576-word x 36-bit CMOS dynamic random access memory module composed of eight 4Mb DRAMs in SOJ packages and two 2Mb DRAMs in SOJ packages mounted with ten decoupling capacitors on a 72-pin glass epoxy single-inline package.

Key Features

  • 1,048,576-word x 36-bit organization.
  • 72-pin socket insertable module MSC23136D/DL-xxBS10 : Gold tab MSC23136D/DL-xxDS10 : Solder tab.
  • Single +5V supply ± 10% tolerance.
  • Input : TTL compatible.
  • Output : TTL compatible, 3-state.
  • Refresh : 1024cycles/16ms (1024cycles/128ms: L-version).
  • /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability.
  • Fast page mode capability.
  • Multi-bit test mode capability.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MSC23136D_OKIelectroniccomponets.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
MSC2320A-10YS9 DRAM Module OKI Semiconductor
MSC2320A-80YS9 DRAM Module OKI Semiconductor
MSC2320A-xxYS9 DRAM Module OKI Semiconductor
MSC2320B-10DS9 DRAM Module OKI Semiconductor
MSC2320B-10YS9 DRAM Module OKI Semiconductor

Other Datasheets by OKI Electric

Part Number Description
MSC23136D DRAM-MODULE
MSC23136C DRAM-MODULE
MSC23136CL DRAM-MODULE
MSC2313258A DRAM-MODULE
MSC2313258D DRAM-MODULE

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet.co.kr This version: Feb. 23. 1999 Semiconductor MSC23136D/DL-xxBS10/DS10 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE DESCRIPTION The MSC23136D/DL-xxBS10/DS10 is a fully decoded, 1,048,576-word x 36-bit CMOS dynamic random access memory module composed of eight 4Mb DRAMs in SOJ packages and two 2Mb DRAMs in SOJ packages mounted with ten decoupling capacitors on a 72-pin glass epoxy single-inline package. This module supports any application where high density and large capacity of storage memory are required. The MSC23136DL (the low-power version) is specially designed for lower-power applications.