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CM1244 Datasheet 4-Channel ESD Array

Manufacturer: onsemi

Overview: CM1244 4-Channel ESD Array in CSP.

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General Description

S 5−bump CSP Package Pin Name Description A1 ESD_1 ESD Channel 1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground C1 ESD_3 ESD Channel 3 C3 ESD_4 ESD Channel 4 CM1244 PACKAGE / PINOUT DIAGRAMS Orientation Marking (see Note) A B Top View (Bumps Down View) 123 + 04 C Bottom View (Bumps Up View) Orientation Marking ESD_3 ESD_4 C1 GND C3 ESD_1 B2 ESD_2 A1 A3 A1 CM1244 CSP Package Note: The “+” orientation marking indicates that the package is lead−free.

SPECIFICATIONS Table 2.

ABSOLUTE MAXIMUM RATINGS Parameter Ratin

Key Features

  • Four Channels of ESD Protection.
  • ±15 kV ESD Protection on Each Channel (IEC 61000.
  • 4.
  • 2 Level 4, Contact Discharge).
  • ±30 kV ESD Protection on Each Channel (HBM).
  • Chip Scale Package Features Extremely Low Lead Inductance for Optimum ESD Protection.
  • 5.
  • bump, 0.760 mm x 1.053 mm Footprint, 0.4 mm Pitch, Chip Scale Package (CSP).
  • OptiGuardt Coating for Improved Reliability at Assembly.
  • These Devices are Pb.
  • F.

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