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  ON Semiconductor Electronic Components Datasheet  

ESD5Z12T1G Datasheet

Transient Voltage Suppressors

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ESD5Z2.5T1G Series,
SZESD5Z2.5T1G Series
Transient Voltage
Suppressors
MicroPackaged Diodes for ESD Protection
The ESD5Z Series is designed to protect voltage sensitive
components from ESD and transient voltage events. Excellent
clamping capability, low leakage, and fast response time, make these
parts ideal for ESD protection on designs where board space is at a
premium. Because of its small size, it is suited for use in cellular
phones, portable devices, digital cameras, power supplies and many
other portable applications.
Specification Features:
Low Clamping Voltage
Small Body Outline Dimensions:
0.047x 0.032(1.20 mm x 0.80 mm)
Low Body Height: 0.028(0.7 mm)
Standoff Voltage: 2.5 V 12 V
Peak Power up to 240 Watts @ 8 x 20 ms Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC6100042 Level 4 ESD Protection
IEC6100044 Level 4 EFT Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree and are RoHS Compliant*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
http://onsemi.com
SOD523
CASE 502
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
XX
1 G2
XX = Specific Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
ESD5ZxxxT1G
SOD523
PbFree
3,000 /
Tape & Reel
SZESD5ZxxxT1G
SOD523
PbFree
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
January, 2014 Rev. 12
1
Publication Order Number:
ESD5Z2.5T1/D


  ON Semiconductor Electronic Components Datasheet  

ESD5Z12T1G Datasheet

Transient Voltage Suppressors

No Preview Available !

ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 6100042 (ESD)
Contact
Air
kV
±30
±30
IEC 6100044 (EFT)
40 A
ESD Voltage
Per Human Body Model
Per Machine Model
kV
16 V
400
Total Power Dissipation on FR4 Board (Note 1) @ TA = 25°C
°PD° 500 mW
Junction and Storage Temperature Range
TJ, Tstg
55 to +150
°C
Lead Solder Temperature Maximum (10 Second Duration)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm2.
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol
Parameter
IPP Maximum Reverse Peak Pulse Current
VC Clamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IR Maximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
IT Test Current
IF Forward Current
VF Forward Voltage @ IF
Ppk Peak Power Dissipation
C Max. Capacitance @VR = 0 and f = 1 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
I
IF
VC VBR VRWM
IIRT VF
V
IPP
UniDirectional TVS
http://onsemi.com
2


Part Number ESD5Z12T1G
Description Transient Voltage Suppressors
Maker ON Semiconductor
Total Page 5 Pages
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