Absolute Maximum Ratings(1), (2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Forward Gate Current
Operating and Storage Junction Temperature Range
-55 to 150
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low-
Values are at TA = 25°C unless otherwise noted.
J111 / J112 /
Total Device Dissipation
PD Derate Above 25°C
625 350 mW
5.0 2.8 mW/°C
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
200 357 °C/W
3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
4. Device mounted on FR-4 PCB 36mm × 18mm × 1.5mm; mounting pad for the collector lead minimum 6cm2.