MMSZ4699ET1G Datasheet | onsemi

Features - 500 m W Rating on FR-4 or FR-5 Board - Wide Zener Reverse Voltage Range - 1.8 V to 43 V - Package Designed for Optimal Automated Board Assembly - Small Package Size for High Density Applications - ESD Rating of Class 3 (> 16 k V) per Human Body Model - Peak Power - 225 W (8 x 20 ms) - AEC-Q101 Qualified and PPAP Capable - SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements - Pb-Free Packages are Available- Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V-0 MAXIMUM RATINGS Rating Symbol Max Unit Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25 °C Total Power Dissipation on FR-5 Board, (Note 2) @ TL = 75 °C Derated above 75 °C Ppk 500 m W 6.7 m W/°C Thermal Resistance, (Note 3) Junction-to-Ambient Rq JA °C/W 340 Thermal Resistance, (Note 3) Junction-to-Lead Rq JL °C/W 150 Junction and Storage Temperature Range TJ, Tstg - 55 to °C +150 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Nonrepetitive current pulse per Figure 11. 2. FR-5 = 3.5 x 1.5 inches, using the minimum remended footprint. 3. Thermal Resistance measurement obtained via infrared Scan Method. - For additional information on our Pb-Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOD-123 CASE 425 STYLE 1 1...