MSR860G
Key Features
- Soft Recovery with Guaranteed Low Reverse Recovery Charge (QRR) and Peak Reverse Recovery Current (IRRM)
- 150°C Operating Junction Temperature
- Epoxy meets UL 94 V-0 @ 0.125 in
- Low Forward Voltage
- Low Leakage Current
- These are Pb-Free Devices Mechanical Characteristics:
- Case: Epoxy, Molded
- Weight: 1.9 Grams (Approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable
- Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds