MURA260T3G Datasheet | onsemi

Features - Small pact Surface Mountable Package with J- Bend Leads - Rectangular Package for Automated Handling - High Temperature Glass Passivated Junction - Low Forward Voltage Drop (1.2 V Max @ 2.0 A, TJ = 150C) - AEC- Q101 Qualified and PPAP Capable - SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements - All Packages are Pb-Free- Mechanical Characteristics: - Case: Epoxy, Molded - Weight: 70 mg (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds - Polarity: Polarity Band Indicates Cathode Lead - ESD Protection:  Human Body Model > 4000 V (Class 3)  Machine Model > 400 V (Class C) http://onsemi. ULTRAFAST RECTIFIER 2 AMPERES, 600 VOLTS SMA CASE 403D PLASTIC MARKING DIAGRAM U5J AYWW G U5J = Device Code A = Assembly Location Y = Year WW = Work Week G = Pb- Free Package ORDERING INFORMATION Device MURA260T3G SURA8260T3G Package SMA (Pb- Free) SMA (Pb- Free) Shipping† 5,000/Tape & Reel 5,000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are remended choices for future use and best overall value. - For additional information on our Pb- Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor ponents Industries, LLC, 2012 January, 2012 - Rev....