NTSM245ESF
Features
- Fine Lithography Trench- based Schottky Technology for Very Low
Forward Voltage and Low Leakage
- Fast Switching with Exceptional Temperature Stability
- Low Power Loss and Lower Operating Temperature
- Higher Efficiency for Achieving Regulatory pliance
- Low Thermal Resistance
- High Surge Capability
- NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC- Q101 Qualified and PPAP Capable
- These are Pb- Free and Halide- Free Devices
Mechanical Characteristics:
- Case: Molded Epoxy
- Epoxy Meets UL 94 V- 0 @ 0.125 in
- Weight: 11.7 mg (Approximately)
- Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
- MSL 1
Typical Applications
- Switching Power Supplies including pact Adapters and Flat
Panel Display
- High Frequency and DC- DC Converters
- Freewheeling and OR- ing diodes
- Reverse Battery Protection
- Instrumentation
- Automotive LED Lighting
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