QRE1113, QRE1113GR
Miniature Reflective
Object Sensor
Features
• Phototransistor Output
• No Contact Surface Sensing
• Miniature Package
• Lead Form Style: Gull Wing
• Two Leadform Options:
♦ Through Hole (QRE1113)
♦ SMT Gull Wing (QRE1113GR)
• Two Packaging Options:
♦ Tube (QRE1113)
♦ Tape and Reel (QRE1113GR)
www.onsemi.com
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Pin 1: Anode
Pin 2: Cathode
Pin 3: Collector
Pin 4: Emitter
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
TOPR
TSTG
TSOL−I
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
(Notes 2, 3, 4)
−40 to +85
−40 to +90
240 for 5 s
°C
°C
°C
TSOL−F
Soldering Temperature (Flow)
(Notes 3, 4)
260 for 10 s
°C
EMITTER
IF
VR
IFP
PD
SENSOR
Continuous Forward Current
Reverse Voltage
Peak Forward Current (Note 5)
Power Dissipation (Note 1)
50 mA
5V
1A
75 mW
VCEO
Collector-Emitter Voltage
30 V
VECO
Emitter-Collector Voltage
5V
IC Collector Current
20 mA
PD Power Dissipation (Note 1)
50 mW
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Derate power dissipation linearly 1.00 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16″ (1.6 mm) from housing.
5. Pulse conditions: tp = 100 ms; T = 10 ms.
REFLECTIVE RECTANGULAR SURFACE MOUNT
CASE 100CY
REFLECTIVE RECTANGULAR THROUGH HOLE
CASE 100AQ
ORDERING INFORMATION
Device
Package
Shipping†
QRE1113
Reflective
Rectangular
(Through Hole)
1600 / Tube
QRE1113GR
Reflective
Rectangular
(Surface Mount)
1000 /
Tape & Reel
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2002
March, 2019 − Rev. 6
1
Publication Order Number:
QRE1113/D