3EZ25 PanJit Semiconductor Datasheet

3EZ25 Key Features

• Low profile package
• Built-in strain relief
• Low inductance
• Plastic package has Underwriters Laboratory Flammability
• High temperature soldering : 260°C /10 seconds at terminals
• In pliance with EU RoHS 2002/95/EC directives
• Case: JEDEC DO-15, Molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes positive end (cathode)
• Standard packing: 52mm tape