ES1AW
Key Features
- For surface mounted applications
- Low profile package
- Built-in strain relief
- Easy pick and place
- Superfast recovery times for high efficiency
- Plastic package has Underwriters Laboratory
- In pliance with EU RoHS 2002/95/EC directives
- Case: JEDEC DO-214AC molded plastic
- Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
- Polarity: Indicated by cathode band
