GDZJ30 Datasheet (PDF) Download
PanJit Semiconductor
GDZJ30

Key Features

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in pliance with EU RoHS 2011/65/EU directives
  • Case: Molded Glass DO-34
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Approx. Weight: 0.0033 ounces, 0.094 grams
  • B - 2K per Bulk box T/R - 10K per 15" plastic Reel T/B - 5K per horiz. tape & Ammo box