GLZ3.0B Overview
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
- Case: Molded Glass MINI-MELF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.001 ounces, 0.03 grams
- Polarity : Color band denotes cathode end
- Packing information T/R
- 2.5K per 7" plastic Reel T/R
